Tire Electronic Component Protection via Rubber Buffer Layers
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Tires with embedded electronic components, such as RFID tags, face functional failure due to stress and distortion during deformation, as these components are often placed at vulnerable boundary surfaces within the tire structure.
Innovation Solution
The electronic component is positioned between two rubber sheets with high modulus, which are arranged to cover the folding end of the carcass ply, providing protection from stress and distortion, and optionally covered by a coating rubber sheet to absorb deformation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the electronic component is arranged at the boundary surface of two different substances (free edge of carcass ply), then the electronic component can be embedded within the tire structure, but stress and distortion occur upon tire deformation causing functional failure
Solution Approach 1:
A buffer layer is introduced between the electronic component and the boundary surface of the carcass ply. This buffer layer acts as an intermediary that absorbs and distributes stress, preventing direct transmission of stress and distortion to the electronic component while maintaining its embedded position within the tire structure.
Solution Approach 2:
The buffer layer is positioned in advance to cushion and absorb stress before it reaches the electronic component. By placing this protective layer beforehand at the boundary surface, the design preemptively mitigates the harmful effects of stress and distortion that occur during tire deformation.
2Ease of manufacture
If the electronic component is positioned at the free edge of the carcass ply, then it can be integrated into the tire structure, but the position is highly susceptible to stress concentration during deformation
Solution Approach 1:
The buffer layer serves as a mediator between the electronic component and the high-stress boundary region. It allows the component to remain integrated at the free edge of the carcass ply for manufacturing simplicity while simultaneously protecting it from stress concentration through stress distribution.
Solution Approach 2:
The buffer layer provides localized protection specifically at the electronic component's position without requiring changes to the overall tire structure. This local modification maintains ease of manufacture while enhancing strength and stress resistance at the critical location.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively suppresses stress concentration and deformation, ensuring the electronic component maintains functionality even under tire deformation, enhancing durability and reliability.
Implementation Method 1
the electronic component covered by the coating rubber sheet is disposed between the first rubber sheet and the second rubber sheet
Implementation Method 2
the first rubber sheet and the second rubber sheet may both be formed in an annular shape, and the first rubber sheet and the second rubber sheet of annular shape may cover the folding end (for example, the folding end 25A) of the carcass ply over an entire circumference thereof
Data Source
AI summary
A tire includes: a bead core; a bead filler which extends to an outer side in the tire-radial direction of the bead core; a carcass ply which extends from the bead core to another bead core, and folded back around the bead core; a first rubber sheet which covers a folding end of the carcass ply folded back from an inner side in the tire-width direction; and a second rubber sheet which covers the folding end of the carcass ply folded back from an outer side in the tire-width direction, in which an electronic component is provided between the first rubber sheet and the second rubber sheet.


