Electronic Module Mounting in Tire Vulcanization
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Solution Overview
Problem
Current methods for attaching electronic modules to tires are inefficient, requiring downtime, precise positioning, and the use of solvents, which can lead to detachment and increased costs, while also posing risks to tire integrity.
Innovation Solution
A method where a non-vulcanized support or patch is molded directly into the tire using a counter-form in the molding cavity, allowing for integration of electronic modules before tire manufacturing, eliminating the need for post-manufacturing immobilization and solvent use, and ensuring secure bonding.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a patch is applied to the tire after molding, then the electronic module can be fixed to the tire, but the tire must be immobilized for a long period and preparation operations are required
Solution Approach 1:
The patch is molded together with the tire in the same manufacturing process, eliminating the need for subsequent preparation and laying operations. The support and electronic module are integrated into the tire structure during the molding process itself, so no later immobilization or surface preparation is needed.
Solution Approach 2:
The patch application process is merged with the tire molding process. The support, electronic module, and tire are manufactured as an integrated assembly in a single operation, combining what were previously separate steps into one unified process.
2Reliability
If a patch is applied after tire manufacture, then the electronic module can be attached, but significant cost is incurred due to equipment and labor
Solution Approach 1:
The patch and tire are manufactured together in the same molding process, eliminating the need for separate equipment and labor for patch application. This integration into the primary manufacturing process reduces overall manufacturing costs.
Solution Approach 2:
The molding process itself creates the bonding between the patch and tire without requiring additional bonding equipment or materials. The vulcanization process that forms the tire also bonds the support and electronic module in place.
3Reliability
If a patch is applied to the tire, then the electronic module can be fixed, but precise positioning at the azimuth level is required
Solution Approach 1:
The support is pre-formed with the electronic module positioned on it before the support is attached to the tire. This preliminary positioning on the support simplifies the subsequent attachment to the tire, as the module is already correctly positioned relative to the support surface.
Solution Approach 2:
The support acts as an intermediary carrier that simplifies positioning. The electronic module is positioned on the support in a controlled manner, and the support itself is then positioned on the tire, breaking the positioning task into two simpler steps.
4Reliability
If a patch is applied to the tire, then the electronic module can be attached, but the bond may detach over time
Solution Approach 1:
The bonding process is merged with the tire vulcanization process. The same heat and pressure that cure the tire rubber also bond the support to the tire, creating a bond that is as strong and durable as the tire itself.
Solution Approach 2:
The bonding is achieved through the vulcanization parameters (temperature and pressure) that are already applied during tire manufacturing. These parameters transform the materials into a permanently bonded state that resists detachment over time.
5Reliability
If solvents are used when applying the patch, then the patch can be bonded to the tire, but harmful effects on the tire are caused
Solution Approach 1:
The harmful solvents are extracted from the bonding process. The bonding is achieved through the vulcanization process itself, which uses heat and pressure rather than chemical solvents, eliminating the harmful effects on the tire.
Solution Approach 2:
The chemical bonding mechanism using solvents is replaced with a physical bonding mechanism using heat and pressure during vulcanization. This substitution eliminates harmful chemicals while achieving effective bonding.
Data Source
Figure 1~2
AI summary
The invention relates to a method for installing a mounting (10) made of elastomer material for an electronic module (11) against a wall of a tyre (12), including the steps in which: i) a moulding cavity (2) is provided in a mould (1); ii) a non-vulcanised mounting (10) is arranged in said moulding cavity (2); and iii) the non-vulcanised mounting (10) is vulcanised simultaneously with the other elements that make up the tyre.