Titanium Columnar Capacitor Films for Higher Capacitance Electrodes

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Solution Overview

Problem

Conductive terminals of capacitors made of metals exhibit low capacitance, making them inconvenient to use.

Innovation Solution

Manufacture high capacitance anode and cathode films using sputter deposition of titanium layers on aluminum foils, followed by controlled reactions with nitrogen and oxygen to form columnar crystal structures, optimizing manufacturing parameters for enhanced capacitance.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If metal conductive terminals are used in capacitors, then electrical conductivity is achieved, but capacitance is low making them inconvenient to use

Engineering Contradiction:
ImprovecapacitanceVSAvoidconvenience of use
Core Design Contradiction:
ReliabilityVSEase of operation

Solution Approach 1:

The invention changes the material parameters of the conductive terminals by forming high capacitance films on metal substrates. The film composition, thickness (10-100 nm for cathode, 10-1000 nm for anode), and microstructure are optimized to achieve high capacitance while maintaining electrical conductivity, thus resolving the contradiction between conductivity and capacitance

Inventive Principle:
Principle #35Parameter changes

Solution Approach 2:

The invention creates composite structures by depositing titanium-based high capacitance films on metal conductive terminal substrates. The composite film structure (with columnar crystal structure for cathode and controlled composition for anode) combines the electrical conductivity of metal substrates with the high capacitance properties of titanium oxide/nitride films, achieving both conductivity and high capacitance

Inventive Principle:
Principle #40Composite materials

2Reliability

If sputter deposition is performed with controlled power density and temperature, then high capacitance film structure is achieved, but manufacturing process complexity increases

Engineering Contradiction:
ImprovecapacitanceVSAvoidmanufacturing process complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The invention specifies controlled ranges for sputter deposition parameters (power density, temperature, pressure) to achieve the desired columnar crystal structure and high capacitance. By defining specific parameter ranges rather than requiring complex real-time control systems, the process achieves high capacitance with manageable manufacturing complexity

Inventive Principle:
Principle #35Parameter changes

Solution Approach 2:

The invention performs preliminary substrate preparation (cleaning, surface treatment) and pre-establishes the sputter deposition parameter ranges before the actual film formation. This preliminary preparation ensures that the subsequent deposition process can achieve high capacitance films with standardized, repeatable procedures, reducing overall process complexity

Inventive Principle:
Principle #10Preliminary action

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The resulting capacitors with high capacitance anode and cathode films are more convenient to use, addressing the inconvenience of low capacitance in existing conductive terminals.

Implementation Method 1

Perform sputter deposition of a first titanium (Ti) layer on a cathode aluminum foil in a vacuum chamber

Methodology Applied
Scientific EffectSputter deposition: Sputtering

Implementation Method 2

titanium (Ti) continuously reacts with nitrogen (N) to carry out combination and deposition

Methodology Applied
Scientific EffectChemical reaction: Chemical Bonding

Implementation Method 3

titanium (Ti) continuously reacts with nitrogen (N) to carry out combination and deposition, while the manufacturing parameters are controlled simultaneously

Methodology Applied
Scientific EffectPhysical vapor deposition: Physical Vapour Deposition

Implementation Method 4

the second titanium (Ti) layer continuously reacts with oxygen (O) and nitrogen (N) to carry out combination and deposition

Methodology Applied
Scientific EffectOxidation: Oxidation

Data Source

PatentUS20250277302A1Method of manufacturing high capacitance anode and cathode films of capacitor
Publication Date: 2025.09.04 TRUSVAL TECH
  • US20250277302A1 patent drawing
  • US20250277302A1 patent drawing
  • US20250277302A1 patent drawing

AI summary

A method of manufacturing high capacitance anode and cathode films of capacitors is revealed. Perform sputter deposition on a cathode aluminum foil in a vacuum chamber to form a cathode metal layer which is a first titanium layer on a surface of the cathode aluminum foil. Then titanium continuously reacts with nitrogen to form cathode columnar crystal deposition on a surface of the cathode metal layer and produce a cathode film. Perform sputter deposition on an anode aluminum foil in a vacuum chamber to form an anode metal layer which is a second titanium layer on a surface of the anode aluminum foil. Then titanium continuously reacts with oxygen and nitrogen to form anode columnar crystal deposition on a surface of the anode metal layer and produce an anode film. Next use the cathode and anode films with high capacitance to form cathode and anode electrodes of the capacitor.