Titanium Heat Dissipation Chamber Forming for Thin High-Strength Cooling
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Solution Overview
Problem
Current heat dissipation units made of copper and other materials face issues such as reduced yield strength, deformation, and limited suitability for harsh environments, while titanium alloys are difficult to process and not easily deformable, making them unsuitable for many applications.
Innovation Solution
A heat dissipation device using commercially pure titanium with a method that involves pre-cleaning, heat treatment, stamping to form raised sections, bonding a metal mesh, and seam welding to create a sealed chamber filled with a working fluid, overcoming the challenges of processing and deformability of titanium.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If copper material is used for heat dissipation units, then heat transfer speed is improved, but yield strength is lowered due to crystalline grain growth at high temperatures
Solution Approach 1:
The patent changes the material parameter from copper to commercially pure titanium, which has different thermal and mechanical properties. Titanium maintains its strength at high temperatures while providing adequate heat dissipation, resolving the contradiction between heat transfer speed and yield strength retention.
Solution Approach 2:
The patent uses commercially pure titanium as a composite material solution that combines adequate thermal conductivity with superior high-temperature strength retention, avoiding the grain growth issues inherent in copper materials.
2Length of moving object
If copper foil is used to reduce thickness, then device thickness is reduced, but structural supporting strength is insufficient
Solution Approach 1:
The patent changes the material parameter from copper foil to commercially pure titanium foil or thin sheet. Titanium's inherently higher strength-to-weight ratio enables the use of thinner materials while maintaining or improving structural supporting strength, thus resolving the contradiction between reduced thickness and sufficient strength.
3Reliability
If titanium alloys are used for heat dissipation units, then corrosion resistance and high-temperature resistance are improved, but ease of manufacture deteriorates due to difficulty in plastic working
Solution Approach 1:
The patent changes the material specification from titanium alloys to commercially pure titanium. The pure titanium form maintains the desired corrosion resistance and high-temperature resistance while being significantly more amenable to plastic working and manufacturing processes, thus resolving the contradiction between reliability and ease of manufacture.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides a thin, flexible heat dissipation device with improved structural strength and corrosion resistance, suitable for harsh environments and capable of returning to its original shape, addressing the limitations of copper and other materials.
Implementation Method 1
perform a heat treatment on the cleaned first and second titanium metal sheets; stamp the first titanium metal sheet to form a plurality of raised sections thereon
Implementation Method 2
seam welding, working fluid filling, vacuumizing and sealing
Data Source
AI summary
A method of manufacturing a heat dissipation device is disclosed. The heat dissipation device manufactured with the method includes two titanium metal sheets, which are subjected to a heat treatment before undergoing mechanical processing, plastic working and surface modification. With these arrangements, the titanium metal sheets can be freely plastically deformed and possess a capillary force, and can therefore be used in place of the conventional copper material to serve as a material for making heat dissipation devices, and the heat dissipation devices so produced can have largely reduced weight and largely improved heat dissipation performance.