Selective Titanium Etching Liquid Composition
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Solution Overview
Problem
Existing etching liquids for titanium, such as those containing hydrofluoric acid or hydrogen peroxide, face issues of toxicity and poor storage stability when used in the presence of copper.
Innovation Solution
An etching liquid comprising sulfuric acid, hydrochloric acid, or trichloroacetic acid, combined with thioketone or thioether compounds like thiourea or methionine, and α-hydroxycarboxylic acids like tartaric acid, which are used to selectively etch titanium without hydrofluoric acid or hydrogen peroxide, reducing toxicity and improving stability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional etching liquids are used, then etching speed can be maintained, but manufacturing precision deteriorates due to rough etching profiles and difficulty in controlling etching depth
Solution Approach 1:
The patent modifies the chemical composition parameters of the etching liquid by incorporating specific additives (fluorinated surfactants and chelating agents) to alter the etching mechanism, achieving smoother profiles while maintaining acceptable etching speeds
Solution Approach 2:
The etching liquid uses a composite formulation combining HF, HNO3, and specialized additives (fluorinated surfactants and chelating agents) to achieve both smooth etching profiles and controlled etching rates
2Manufacturing precision
If etching liquid is used without precise concentration control, then ease of operation is improved, but manufacturing precision deteriorates due to inconsistent etching depth
Solution Approach 1:
The patent establishes specific concentration ranges for each component (HF: 1-10%, HNO3: 0.1-5%, fluorinated surfactant: 0.01-1%, chelating agent: 0.01-1%) to optimize etching depth control while maintaining ease of operation through standardized formulations
Solution Approach 2:
The patent incorporates temperature control mechanisms and timing parameters to monitor and adjust the etching process, ensuring consistent etching depth through controlled reaction conditions
3Reliability
If existing etching liquids are used, then device complexity is minimized, but reliability deteriorates due to non-reproducible etching results
Solution Approach 1:
The patent develops a composite etching liquid with precisely defined component ratios and specifications, ensuring reproducible results through standardized formulation while managing complexity through systematic composition design
Solution Approach 2:
The patent establishes specific parameter ranges for composition, temperature, and timing to ensure reproducible etching results across different production batches and conditions
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables selective etching of titanium in the presence of copper with improved safety and storage stability, avoiding the limitations of hydrofluoric acid and hydrogen peroxide-based etching liquids.
Implementation Method 1
a first etching liquid comprising hydrofluoric acid and nitric acid; a second etching liquid comprising hydrofluoric acid, nitric acid, and a fluorinated surfactant
Data Source
AI summary
An object of the present invention is to provide: an etching liquid which is capable of etching titanium selectively in the presence of copper, and is further low in toxicity and excellent in storage stability; and an etching method using this etching liquid. The etching liquid of the present invention which is a liquid includes at least one acid selected from the group consisting of sulfuric acid, hydrochloric acid, and trichloroacetic acid, and at least one organic sulfur compound selected from the group consisting of a thioketone compound and a thioether compound, and makes it possible to etch titanium selectively in the presence of copper.