Titanium Target Hardness and Orientation for Sputtering Stability
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Solution Overview
Problem
Existing titanium targets for sputtering suffer from impurity-related particle formation, cracking, and instability during high-power sputtering, which affects film quality and integration density in electronic instruments.
Innovation Solution
A titanium target with a Shore hardness of 20 or more, a basal plane orientation ratio of 70% or less, and a purity of 99.995% or higher, combined with specific impurity elements like Al, Si, and others in trace amounts, to enhance strength and prevent cracking, while maintaining film quality and reducing particle formation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-generated harmful factors
If titanium target purity is increased to reduce impurities, then particle formation is suppressed, but cracking and breaking occur during high-power sputtering
Solution Approach 1:
The patent applies parameter changes by precisely controlling the crystal grain size (10-20 μm) and crystal structure (basal plane orientation ratio) of the titanium target. These parameter modifications enable the target to achieve both high purity (reducing particles) and adequate mechanical strength (preventing cracking during high-power sputtering).
Solution Approach 2:
The patent creates a composite structure within the titanium target by controlling the crystal grain morphology and orientation. The specific crystal structure with controlled basal plane orientation creates an internally composite arrangement that simultaneously provides purity and mechanical strength, resolving the contradiction between reducing particles and preventing cracking.
2Productivity
If high-power sputtering is used to increase production efficiency, then productivity improves, but cracking and breaking of the target occur
Solution Approach 1:
The patent modifies the physical parameters of the titanium target, specifically controlling crystal grain size (10-20 μm) and basal plane orientation ratio, to enable the target to withstand the thermal and mechanical stress of high-power sputtering. This allows high productivity to be achieved without target cracking or breaking.
3Strength
If titanium target hardness is increased to prevent cracking, then strength improves, but adhesion strength decreases causing peeling off
Solution Approach 1:
The patent optimizes the hardness parameter by controlling crystal grain size (10-20 μm) and structure to achieve an optimal balance. The controlled crystal structure provides sufficient hardness to prevent cracking while maintaining adequate adhesion strength to prevent peeling off during sputtering operations.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively suppresses particle formation and abnormal discharges, prevents cracking, and stabilizes sputtering characteristics, ensuring high-quality film formation even under high-power conditions.
Implementation Method 1
it should be paid attention that titanium itself is required to have a significantly high purity... films of titanium, its alloy, titanium silicide, or titanium nitride can be formed by physical vapor deposition such as sputtering or vacuum vapor deposition
Data Source
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AI summary
Provided is a titanium target for sputtering having a Shore hardness Hs of 20 or more and a basal plane orientation ratio of 70% or less. In the titanium target for sputtering, the purity of titanium is 99.995 mass% or more, excluding gas components. It is an object of the present invention to provide a high-quality titanium target for sputtering, in which impurities are reduced, and which can prevent occurrence of cracking or breaking in high-power sputtering (high-rate sputtering), stabilize sputtering characteristics, and effectively suppress occurrence of particles during formation of a film.