Titanium Two-Phase Cooling Module for Thin Portable Devices
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Solution Overview
Problem
Existing cooling solutions for semiconductor devices, particularly in portable electronics, face challenges in efficiently managing heat due to size constraints and the need for both high thermal performance and mechanical strength, while minimizing weight and power consumption.
Innovation Solution
The development of titanium-based two-phase cooling devices with complex shapes, featuring microfabricated metal substrates, etched microstructures, and a wicking structure that utilizes capillary forces to transport thermal energy, including a vapor cavity and intermediate substrates to optimize heat transfer and mechanical strength.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If traditional cooling solutions are used in portable devices, then heat dissipation is achieved, but the device thickness and weight increase
Solution Approach 1:
The patent employs two-phase heat transfer mechanisms where a working fluid undergoes phase transitions (liquid to vapor and vapor to liquid) to transfer heat efficiently. The thermal module includes an evaporator region where liquid vaporizes, a condenser region where vapor condenses, and an adiabatic region connecting them, enabling high-efficiency heat dissipation in a thin profile without requiring thick heat sinks or fans
Solution Approach 2:
The patent integrates multiple functional regions (evaporator, adiabatic, condenser) within a single compact thermal module structure. The working fluid channels and phase change regions are nested within the thin substrate, allowing the entire heat dissipation system to be embedded within the portable device's existing structure rather than adding external cooling components
2Strength
If titanium substrate with microstructures is used, then thermal performance and mechanical strength are improved, but manufacturing complexity increases
Solution Approach 1:
The patent utilizes laser parameters (power, speed, pulse duration) to directly transform titanium substrate into complex 3D microstructures with precise control over geometry, depth, and spacing. This parameter-based approach enables manufacturing of high-aspect-ratio wicking structures and phase change regions that would be difficult to achieve with traditional mechanical machining, balancing manufacturing ease with structural complexity
Solution Approach 2:
The patent replaces traditional mechanical machining methods with laser-based additive and abductive manufacturing. The laser directly writes complex microstructures, channels, and wicking patterns into the titanium substrate without mechanical contact, eliminating the need for complex tooling, molds, or assembly steps while achieving high precision and mechanical strength
3Length of moving object
If thin substrate is used, then device portability is improved, but thermal energy transfer capability decreases
Solution Approach 1:
The patent compensates for the thin substrate limitation by utilizing the high latent heat of vaporization and condensation of the working fluid. The phase change process occurs within the thin substrate volume, allowing large amounts of thermal energy to be transferred through the thin structure without requiring thick heat sinks. The evaporator and condenser regions are separated by a thin adiabatic barrier, enabling efficient heat pumping through the portable device
Solution Approach 2:
The patent transitions from planar 2D heat spreading to 3D volumetric heat transfer by creating high-aspect-ratio microstructures and channels within the thin substrate. The laser-written features include vertical channels, three-dimensional wicking structures, and layered evaporator-condenser regions that utilize the substrate's thickness dimension efficiently, enabling high thermal power transfer despite the overall thin profile
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
These devices provide enhanced thermal performance, reduced thickness, and increased robustness, enabling efficient heat dissipation in compact portable devices while maintaining mechanical strength and reducing weight, thus improving battery life and device reliability.
Implementation Method 1
a fluid may be contained within the wicking structure and vapor cavity for transporting thermal energy from one region of the thermal ground plane to another region of the thermal ground plane, wherein the fluid may be driven by capillary forces within the wicking structure
Implementation Method 2
the working fluid adsorbs or rejects heat by changing phases between liquid and vapor
Implementation Method 3
the fluid may be driven by capillary forces within the wicking structure
Data Source
AI summary
The present application discloses two-phase cooling devices that may include at least three substrates: a metal with a wicking structure, an intermediate substrate and a backplane. The titanium thermal module may be adapted for use in a mobile device, such as a portable device or smartphone, where it may offer compelling performance advantages. The thermal module may also have a metal layer which may act as a shield for radiation or an antenna for radiation, or may add mechanical strength to the thermal module.