TJBS Diode Trench Layout for Shorter Vertical Current Paths

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Solution Overview

Problem

Conventional semiconductor structures with trench junction Schottky (TJBS) diodes have a long current path due to the position of the junction Schottky barrier, resulting in higher resistance.

Innovation Solution

A semiconductor structure with a TJBS diode integrated in parallel to a UMOS structure, where the insulating layer on the sidewall of the TJBS diode does not have a side gate, allowing for a vertical current path from the source through a gap, thereby positioning the Schottky barrier at the lowest point between the metal layer and the N-drift region for a shorter, perpendicular current path.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If the junction Schottky barrier is positioned in the conventional location, then the device structure is simpler, but the current path becomes too long resulting in higher resistance

Engineering Contradiction:
ImproveresistanceVSAvoiddevice structure
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The Schottky barrier junction is repositioned from a conventional planar configuration to a vertical configuration at the bottom of the trench. This dimensional change allows the current path to flow vertically through the gap at the trench bottom, significantly shortening the current path length and reducing resistance while maintaining structural simplicity through the use of standard trench formation processes

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

2Reliability

If the Schottky barrier is positioned to shorten the current path, then resistance decreases, but the device area may increase

Engineering Contradiction:
ImproveresistanceVSAvoiddevice area
Core Design Contradiction:
ReliabilityVSArea of stationary object

Solution Approach 1:

The insulating layer is selectively positioned only at the sidewalls of the trench, leaving the bottom of the trench free of insulating material. This local quality differentiation allows the Schottky barrier to form directly at the trench bottom with a vertical current path, shortening the current path length without requiring additional lateral space, thus reducing resistance while maintaining compact device area

Inventive Principle:
Principle #3Local quality

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration reduces the current path length and resistance, enabling a more efficient semiconductor structure with lower resistance and smaller area.

Implementation Method 1

the Schottky barrier is located at the junction between the lowest point of the metal layer (5) of the source (S) and the N-drift region (10c)

Methodology Applied
Scientific EffectSchottky barrier:

Data Source

PatentUS11810974B2Semiconductor structure with trench junction barrier schottky (TJBS) diode
Publication Date: 2023.11.07 NATIONAL TSING HUA UNIVERSITY
  • US11810974B2 patent drawing
  • US11810974B2 patent drawing
  • US11810974B2 patent drawing

AI summary

A semiconductor structure includes: a U-metal-oxide-semiconductor field-effect transistor (UMOS) structure; and a trench junction barrier Schottky (TJBS) diode, wherein an insulating layer of a sidewall of the TJBS diode does not have a side gate.