TLCP Molded Body Plasma Surface Treatment for Adhesion

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Solution Overview

Problem

Thermoplastic liquid crystal polymer (TLCP) molded bodies have poor adhesion properties, particularly when used with adhesives other than epoxy or acrylic, which can compromise the excellent dielectric characteristics of TLCP films.

Innovation Solution

The TLCP molded body is treated with plasma at a high output per unit area for a short processing time, modifying the surface to achieve specific ratios of peak areas based on X-ray photoelectron spectroscopy analysis, thereby enhancing adhesion to a wide range of adhesion targets.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Strength

If conventional plasma treatment is applied to TLCP molded bodies, then adhesion to epoxy or acrylic adhesives is improved, but adhesion to other types of adhesives remains poor and processing time is extended

Engineering Contradiction:
Improveadhesion strengthVSAvoidprocessing time
Core Design Contradiction:
StrengthVSLoss of time

Solution Approach 1:

The invention changes the plasma treatment parameters by increasing the output per unit area to 3.0 W/cm² or higher and reducing the processing time to 10 seconds or less. This parameter optimization achieves sufficient surface modification for improved adhesion to various adhesives (not limited to epoxy or acrylic) while minimizing processing time, thereby resolving the contradiction between adhesion strength and processing time efficiency

Inventive Principle:
Principle #35Parameter changes

2Strength

If surface treatment is applied to improve adhesion, then adhesion property is enhanced, but the excellent dielectric characteristics of TLCP films may be compromised

Engineering Contradiction:
Improveadhesion propertyVSAvoiddielectric characteristics
Core Design Contradiction:
StrengthVSReliability

Solution Approach 1:

The invention applies surface treatment only to the adherend portion (surface) of the TLCP molded body, leaving the bulk material properties unchanged. The plasma treatment modifies only the surface chemistry to improve adhesion, while the interior TLCP material retains its excellent dielectric characteristics, thus resolving the contradiction between adhesion enhancement and dielectric property preservation

Inventive Principle:
Principle #3Local quality

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The modified TLCP molded body exhibits improved initial adhesion and long-term adhesion strength to various adhesives, maintaining high reliability and durability, especially in electronic circuit board applications.

Implementation Method 1

the surface treatment is performed by irradiating plasma to at least an adherend portion of the thermoplastic liquid crystal polymer molded body so as to carry out surface treatment under acidic gas atmosphere

Methodology Applied
Scientific EffectPlasma treatment: Plasma

Implementation Method 2

a ratio of the sum of peak intensities of [—C—O— bond] and [—COO— bond] based on a C(1s) peak intensity

Methodology Applied
Scientific EffectX-ray photoelectron spectroscopy: Photoelectric Effect

Data Source

PatentUS12233620B2Thermoplastic liquid crystal polymer molded body and method for manufacturing same
Publication Date: 2025.02.25 KURARAY CO LTD
  • US12233620B2 patent drawing
  • US12233620B2 patent drawing
  • US12233620B2 patent drawing

AI summary

A thermoplastic liquid crystal polymer (TLCP) molded body including a thermoplastic polymer capable of forming an optically anisotropic melt phase. The TLCP molded body includes an adherend portion in at least a part of the TLCP molded body. The adherend portion has a surface satisfying: a ratio <C—O>/<COO> of 1.5 or greater in which the <C—O> represents a proportion of a peak area of [C—O bond] to a C(1s) peak area, and the <COO> represents a proportion of a peak area of [COO bond] based on the C(1s) peak area; and a ratio <C═O>/<COO> of 0.10 or higher in which the <C═O> represents a proportion of a peak area of [C═O bond] based on the C(1s) peak area, and the <COO> represents the proportion of the peak area of the [COO bond] based on the C(1s) peak area in a result of X-ray photoelectron spectroscopy analysis.