TM-Mode Dielectric Filter Buffer Pad for Balanced Rod Stress
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Solution Overview
Problem
Existing TM-mode dielectric filters face issues with poor bracing contact and unbalanced stress between the metal and dielectric resonant rods, affecting performance due to the use of elastic structures that lead to uneven stress distribution.
Innovation Solution
A TM-mode dielectric filter design that includes a support structure, a buffer pad, and tuning assemblies to ensure balanced stress and improved bracing contact, using materials like brass or purple copper for the buffer pad and 1215 steel or DC04 steel for the support structure, eliminating the need for elastic structures.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If elastic structures are used between the metal resonant rod and the dielectric resonant rod to ensure tight fit, then the bracing contact is improved, but the stress distribution becomes unbalanced and the dielectric resonant rod may crack
Solution Approach 1:
The patent introduces a buffer pad as an intermediary component between the cover plate and the dielectric resonant rod. This buffer pad acts as a mediator that distributes the pressing force uniformly across the end surface of the dielectric resonant rod, preventing localized stress concentration while maintaining reliable bracing contact. The buffer pad material is specifically selected to be softer than both the cover plate and the dielectric resonant rod to achieve optimal stress distribution.
2Reliability
If the cover plate presses directly against the dielectric resonant rod to secure it, then the fixing reliability is improved, but the stress becomes concentrated and affects filter performance
Solution Approach 1:
The patent applies local quality by making the buffer pad material softer than both the cover plate and the dielectric resonant rod. This localized material property change allows the buffer pad to deform and distribute the pressing force uniformly across the contact area, preventing stress concentration at specific points while maintaining overall fixing reliability.
3Device complexity
If traditional elastic deformation methods are used to brace the dielectric resonant rod, then the structural simplicity is maintained, but the bracing contact quality deteriorates
Solution Approach 1:
The buffer pad serves as a simple intermediary component that significantly improves bracing contact quality. By placing this soft material between the cover plate and the dielectric resonant rod, the patent achieves uniform stress distribution and reliable contact without introducing complex elastic deformation mechanisms or additional adjustment structures.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design achieves better bracing contact, balanced stress, reduced size, and improved stability, with a 30% reduction in filter size and enhanced performance by using dual-mode resonators and high dielectric constants, while avoiding dielectric cracks from coefficient mismatch.
Implementation Method 1
A transverse magnetic (TM)-mode dielectric filter uses a dielectric resonant rod with a high dielectric constant and a low loss
Implementation Method 2
an elastic structure is generally disposed between the metal resonant rod and the dielectric resonant rod, or the elastic deformation of the metal resonant rod braces the dielectric resonant rod
Data Source
AI summary
Provided is a TM-mode dielectric filter including a housing, a support structure, a dielectric resonant rod, a cover plate, a buffer pad, and a plurality of tuning assemblies. A resonant cavity is disposed on the housing, the support structure is disposed on a bottom of the resonant cavity, one end of the dielectric resonant rod is mounted on the support structure, multiple adjustment holes are disposed on the dielectric resonant rod, the cover plate is connected to the housing and covers an opening of the resonant cavity, the buffer pad is disposed in the resonant cavity, covers another end of the dielectric resonant rod, and is sandwiched between the dielectric resonant rod and the cover plate, and the plurality of tuning assemblies is disposed on the cover plate, and each adjustment hole of the multiple adjustment holes is configured with a corresponding one of the plurality of tuning assemblies.