TM Mode Filter Transition Layer for CTE-Matched Dielectric Contact

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Solution Overview

Problem

Conventional metal cavity filters face challenges in achieving good contact between the dielectric and cavity due to thermal expansion, leading to performance issues such as loss, passive inter-modulation, and reliability concerns in TM mode filters.

Innovation Solution

A TM mode filter design incorporating a transition layer with a coefficient of thermal expansion (CTE) between the filter body and dielectric, along with a metal layer for secure connection, and step-shaped protrusion structures to ensure proper contact and minimize CTE mismatch, allowing for effective welding and reduced insertion loss.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If a conventional mounting manner is used to connect the dielectric and cavity, then the structure is simple, but the contact quality deteriorates due to CTE mismatch under thermal expansion

Engineering Contradiction:
Improvecontact quality between dielectric and cavityVSAvoidmounting structure complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

A transition layer is introduced as an intermediary component between the dielectric and the metal cavity. This transition layer has a CTE value that is intermediate between the dielectric and the metal cavity, serving as a thermal expansion buffer that accommodates the CTE mismatch. The transition layer includes a first transition sublayer connected to the dielectric and a second transition sublayer connected to the metal cavity, creating a gradual transition in thermal expansion properties that maintains reliable contact under temperature variations.

Inventive Principle:
Principle #24Intermediary (Mediator)

2Loss of energy

If the dielectric and cavity are fully and securely contacted to ensure low loss and high reliability, then the filter performance is improved, but the manufacturing difficulty increases due to CTE mismatch

Engineering Contradiction:
Improveinsertion lossVSAvoidmanufacturing difficulty
Core Design Contradiction:
Loss of energyVSEase of manufacture

Solution Approach 1:

The invention changes the thermal expansion parameter by selecting specific materials for the transition layer with CTE values between the dielectric and metal cavity. The first transition sublayer is made of a material with a first CTE value, and the second transition sublayer is made of a material with a second CTE value, creating a gradient that accommodates thermal expansion differences. This parameter optimization enables secure contact while maintaining manufacturing feasibility.

Inventive Principle:
Principle #35Parameter changes

3Reliability

If a transition layer is introduced to resolve CTE mismatch, then the contact reliability is improved, but the device complexity increases

Engineering Contradiction:
Improvecontact stability under thermal expansionVSAvoidnumber of layers and materials
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The transition layer is segmented into multiple sublayers, each with different material properties and CTE values. The first transition sublayer is optimally matched to the dielectric, while the second transition sublayer is optimally matched to the metal cavity. This segmentation allows each sublayer to independently manage the thermal expansion interface with its adjacent component, improving overall contact stability while distributing the complexity across functional segments.

Inventive Principle:
Principle #1Segmentation

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution achieves stable and reliable contact between the dielectric and cavity, enhancing the performance of TM mode filters by resolving CTE mismatch issues, improving reliability, and enabling miniaturization while maintaining low insertion loss.

Implementation Method 1

A coefficient of thermal expansion CTE of the transition layer is between a CTE of the filter body and a CTE of the dielectric

Methodology Applied
Scientific EffectCoefficient of thermal expansion (CTE) mismatch: Thermal Expansion

Implementation Method 2

the first metal layer is configured to connect the dielectric and the transition layer

Methodology Applied
Scientific EffectWelding: Welding

Data Source

PatentUS11990661B2TM mode filter and method for manufacturing TM mode filter
Publication Date: 2024.05.21 HUAWEI TECH CO LTD
  • US11990661B2 patent drawing
  • US11990661B2 patent drawing
  • US11990661B2 patent drawing

AI summary

The present disclosure relates to transverse magnetic wave (TM) mode filters and methods for manufacturing a TM mode filter. One example TM mode filter includes a filter body, a dielectric, and a transition layer, the filter body including a filter cavity and a cover, and having hollow confined space, the dielectric located in the hollow confined space, and the transition layer configured to connect the dielectric and the filter body. A coefficient of thermal expansion (CTE) of the transition layer is between a CTE of the filter body and a CTE of the dielectric.