Semiconductor Packages Using Through Mold Ball Connectors
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Solution Overview
Problem
Current semiconductor packages face challenges in reducing the pitch size of interconnection lines or pads to improve bandwidth, leading to bottlenecks in communication between memory and processor chips, which degrades electronic system performance.
Innovation Solution
The method involves forming an interconnection structure layer with conductive trace patterns and a dielectric layer on a dummy wafer, attaching a carrier wafer, and using through mold ball connectors (TMBCs) with copper balls to expose portions of these connectors, allowing for the attachment of outer connectors and mounting of semiconductor devices, thereby reducing signal paths and improving operation speed.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If the pitch size of interconnection lines or pads is reduced to improve bandwidth, then communication bandwidth between memory and processor chips is improved, but manufacturing precision requirements increase
Solution Approach 1:
The patent transitions from planar interconnection to three-dimensional vertical interconnection using TMBCs that penetrate through the molding layer. This dimensional change allows signal paths to be established in the vertical direction, enabling improved bandwidth without requiring further reduction of lateral pitch dimensions, thus resolving the contradiction between bandwidth improvement and manufacturing precision requirements.
Solution Approach 2:
The patent introduces TMBCs as intermediary connection elements that bridge the interconnection structure layer and outer connectors. These TMBCs serve as mediators that enable high-bandwidth communication without directly requiring reduced pitch of traditional interconnection lines, thereby resolving the contradiction by providing an alternative connection pathway.
2Ease of manufacture
If traditional solder balls are used for connectors, then ease of manufacture is maintained, but reliability decreases due to lower melting points
Solution Approach 1:
The patent changes the material parameter of connector balls from traditional solder materials to copper-based materials. This parameter change increases the melting point and thermal stability of the connectors, improving reliability while maintaining manufacturability through established copper ball grid array (CBGA) manufacturing processes.
Data Source
AI summary
There is provided a structure and a method of manufacturing a semiconductor package. The method includes disposing a first semiconductor device and through mold ball connectors (TMBCs) on a first surface of an interconnection structure layer, recessing a molding layer on the first surface of the interconnection structure layer to expose a portion of each of the TMBCs, attaching outer connectors to the exposed portions of the TMBCs, and mounting a second semiconductor device on a second surface of the interconnection structure layer opposite to the molding layer.