TO Package Memory for Early Defect Detection
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Solution Overview
Problem
Testing and manufacturing of optoelectronic devices, particularly TO packages, are costly and inefficient due to the need for repeated testing at multiple levels, which increases time and costs without providing early detection of defects or quality issues.
Innovation Solution
Incorporating memory within the TO package to store diagnostic and test data, allowing for individual component testing and reducing the need for subsequent testing at subassembly and assembly levels by making this data available to external devices for analysis and calibration.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If testing is performed at component, subassembly, and assembled device levels, then quality assurance is improved, but cost and time consumption increase significantly
Solution Approach 1:
The patent applies preliminary action by performing comprehensive testing at the component level before assembly, and storing the test results in memory within the component. This preliminary testing and data storage eliminates the need for repeated testing at subassembly and assembled device levels, thereby reducing total testing time while maintaining quality assurance through early defect detection.
2Reliability
If testing is performed at component, subassembly, and assembled device levels, then quality assurance is improved, but cost increases significantly
Solution Approach 1:
The patent reduces manufacturing cost by performing preliminary comprehensive testing at the component level and storing results in on-component memory. This eliminates the need for costly repeated testing at subassembly and assembled device levels, while maintaining quality assurance through early defect detection and documentation.
Solution Approach 2:
The patent merges the testing function and data storage function into the component itself by integrating memory within the component package. This consolidation eliminates the need for external testing equipment and data storage systems at subsequent assembly levels, thereby reducing manufacturing cost while maintaining quality assurance.
3Productivity
If memory is incorporated within the TO package, then testing efficiency is improved by enabling early defect detection, but device complexity increases
Solution Approach 1:
The patent merges multiple functions (testing, data storage, and component operation) into a single integrated package. By incorporating memory directly within the TO package, the system eliminates the need for separate external testing equipment and data storage systems, thereby improving testing efficiency while the integration actually reduces overall system complexity despite adding internal components.
Data Source
AI summary
A transistor outline (TO) package includes a housing having a window and a substrate. Circuitry is coupled to the substrate within the housing. The circuitry comprises a laser diode and memory configured to store information related to the TO package. Electrical connectors are coupled to the substrate at the opposite side to the circuitry. At least one of the electrical connectors is electrically connected to the memory. A disclosed method includes assembling a TO package, testing the TO package, storing results of the testing in memory, and making the information stored in the memory, including the results of the testing, available to a device external to the TO package. The TO package includes a laser diode and memory configured to store information related to the TO package.