TO Package Optical Splitting for Multi-Channel Signal Transmission
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Solution Overview
Problem
Conventional transistor outline (TO) packages are limited to transmitting a single-channel/single-wavelength signal, requiring multiple packages for multi-channel operations, which increases complexity and costs due to the need for complex optical path designs and larger package sizes.
Innovation Solution
A TO package configuration that includes a transistor base, cap, main lens, and optical splitting component, allowing for the transmission of at least two light rays through wavelength division multiplexing, thereby improving integration and reducing package size.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If multiple conventional TO packages are used to transmit multiple channels, then signal transmission capability is improved, but device complexity and package size increase
Solution Approach 1:
The patent combines multiple optical channels into a single TO package by integrating multiple laser diodes (LDs) and photodiodes (PDs) within one package structure. The optical splitting component divides the optical path to guide different wavelength channels through a shared main lens, merging what would traditionally require separate packages into one integrated unit. This reduces device complexity while maintaining multi-channel transmission capability.
Solution Approach 2:
The TO package is designed to perform multiple functions simultaneously - it can transmit and receive multiple wavelength channels through a single package structure. The main lens serves multiple channels, and the optical splitting component enables the package to handle both TOSA and ROSA functions for different wavelengths within the same physical package, achieving multi-functionality that reduces overall system complexity.
2Adaptability or versatility
If multiple conventional TO packages are integrated, then multi-channel signal transmission is achieved, but material costs and production costs increase
Solution Approach 1:
By merging multiple optical channels into a single TO package, the patent reduces the total quantity of packages required. Instead of needing multiple separate TO packages for multi-channel transmission, the invention integrates them into one package, thereby reducing material consumption and production costs associated with manufacturing, assembling, and testing multiple separate packages.
3Adaptability or versatility
If conventional TO packages are used with complex optical paths, then multi-channel transmission is possible, but manufacturing difficulty increases
Solution Approach 1:
The optical path within the package is segmented using the optical splitting component, which divides the optical path into distinct channels while maintaining a compact structure. This segmentation allows for easier manufacturing by enabling modular assembly of optical components and simplifying the alignment process, as each channel can be independently adjusted and tested within the unified package structure.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enables the transmission of multiple signals using a single TO package, simplifying the optical sub-assembly design, reducing material and production costs, and facilitating miniaturization of optical modules.
Implementation Method 1
the optical splitting component is disposed between the first chip and the main lens and is configured to adjust a transmission direction of the first light ray; and in addition, the optical splitting component is disposed between the second chip and the main lens and is configured to adjust a transmission direction of the second light ray
Implementation Method 2
The main lens is disposed on a top of the transistor cap, and the main lens runs through the transistor cap. The main lens is configured to transmit a total light ray of the transistor outline package.
Data Source
AI summary
An example transistor outline package includes an accommodation cavity formed by a transistor cap and a transistor base. A main lens is disposed on a top of the transistor cap and runs through the transistor cap, and is configured to transmit a total light ray. The total light ray includes a first light ray and a second light ray. A first chip, a second chip, and an optical splitting component are disposed in the accommodation cavity. The first light ray is transmitted between the first chip and the main lens, and the first chip is an optical transmitter chip. The second light ray is transmitted between the second chip and the main lens. The optical splitting component is disposed between the first chip and the main lens and is configured to adjust a transmission direction of the first light ray.