TO-CAN Light Source Height Adjustment and Thermal Management
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Solution Overview
Problem
Conventional light source devices in the TO-CAN package structure struggle to meet various requirements due to limitations in height adjustment and heat dissipation efficiency.
Innovation Solution
The introduction of an uplift block under the substrate allows for adjustable height positioning of the light emitting unit and enhances heat dissipation through structural design elements like heat-dissipation pillars and metal pillars, integrated with a metal shield to prevent external interference.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If conventional TO-CAN package structure is used, then device structure is simple, but height adjustment capability is poor and heat dissipation efficiency is insufficient
Solution Approach 1:
The device is divided into multiple functional layers including substrate, uplift block, metal shield, and sealing structure. Each layer performs a specific function, allowing independent optimization of height adjustment and heat dissipation without compromising overall simplicity.
Solution Approach 2:
The uplift block serves multiple functions: it provides height adjustment for the light emitting unit, acts as a heat dissipation pathway, and contributes to the overall structural support. This multi-functionality improves adaptability without proportionally increasing complexity.
2Temperature
If conventional TO-CAN package structure is used, then manufacturing process is simple, but heat dissipation efficiency is insufficient
Solution Approach 1:
The uplift block acts as an intermediary heat dissipation structure between the substrate and the metal shield. It provides additional thermal pathways without requiring fundamental changes to the manufacturing process, thus improving heat dissipation while maintaining ease of manufacture.
Solution Approach 2:
The device employs composite material structures including metal shields, ceramic substrates, and various electrode layers. These composite materials provide superior thermal conductivity and heat dissipation performance while being compatible with existing manufacturing techniques.
3Object-affected harmful factors
If conventional TO-CAN package structure is used, then device structure is compact, but external signal interference protection is insufficient
Solution Approach 1:
The metal shield is nested within the sealing structure, creating a layered protective configuration. This nested arrangement provides effective electromagnetic shielding and external interference protection while maintaining a compact overall device footprint without significantly increasing structural complexity.
Solution Approach 2:
The metal shield, which adds structural complexity, converts the potential harm of external signal interference into a beneficial protective function. The same structural element that increases complexity also provides the shielding effect needed to block external interference.
4Reliability
If conventional TO-CAN package structure is used, then inductance is higher, but device structure is simpler
Solution Approach 1:
The circuit board is positioned at a specific height above the reference plane created by the uplift block and metal shield structure. This vertical dimensionality change reduces parasitic inductance by optimizing the current return path, thereby improving operation stability while maintaining reasonable structural complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enables the light source device to adapt to different height requirements and improves heat dissipation efficiency, providing a more stable and efficient operation by reducing inductance and preventing external signal interference.
Implementation Method 1
the heat dissipation efficiency of the substrate can be effectively increased through the structural design of the uplift block of the present embodiment (e.g., the top electrode layer, the lower electrode layer, the heat-dissipation pillar, the metal pillar, and/or the extension circuit)
Data Source
AI summary
The light source device includes a substrate, a light emitting unit mounted on the substrate, a frame disposed on the substrate, a metal shield fixed to an inner side of the frame and electrically coupled to the substrate, a light permeable member disposed on the frame, a cover plate disposed on the light permeable member and fixed to the frame, a detection unit electrically coupled to the substrate, and an uplift block that provides for the substrate to be disposed thereon.