TOF Camera Module Base Assembly Layout for Miniaturization
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Solution Overview
Problem
Existing TOF depth information camera modules face challenges in miniaturization due to the limited space and inconsistent size configurations of the projection and receiving assemblies, leading to inefficient space utilization and assembly accuracy issues in modern mobile terminals.
Innovation Solution
A base assembly is introduced that adjusts the installation layout of the projection and receiving assemblies, with the projection assembly mounted on a top side of the base body and the receiving assembly on the circuit board, allowing for a modular structure and conductive elements to establish connections, thereby optimizing space utilization and reducing the overall size of the camera module.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the projection assembly and receiving assembly are directly mounted on the circuit board, then the assembly structure is simple, but the space utilization is poor and the module size is large
Solution Approach 1:
The patent divides the assembly into separate functional modules: a base assembly (containing the circuit board and receiving assembly) and a projection assembly mounted on the base assembly. This segmentation allows independent optimization of each module and improves overall space utilization.
Solution Approach 2:
The patent transitions from a two-dimensional planar layout (both assemblies on the same circuit board plane) to a three-dimensional stacked configuration (projection assembly mounted on top of the base assembly), effectively utilizing vertical space and reducing the horizontal footprint.
2Shape
If the projection assembly is mounted higher to reduce height difference, then the top surfaces become flush, but the assembly complexity increases
Solution Approach 1:
The patent introduces a base assembly as an intermediary structure between the circuit board and the projection assembly. This base assembly includes a mounting platform that raises the projection assembly to the appropriate height, achieving flush top surfaces while managing the complexity through modular design.
3Reliability
If electronic components are covered by the base body, then electromagnetic interference is reduced and heat dissipation is enhanced, but the manufacturing precision requirements increase
Solution Approach 1:
The patent merges multiple functions into the base assembly: it serves as the circuit board mounting platform, the receiving assembly support, the projection assembly base, and the electromagnetic shielding structure. This consolidation improves reliability through better EMI isolation while managing manufacturing precision through integrated design.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enhances space utilization, reduces the size of the camera module, improves assembly efficiency, and maintains the structural stability and reliability of the TOF depth information camera module, making it suitable for miniaturized mobile terminals.
Implementation Method 1
a conductive element, and the conductive element is disposed between the projection assembly circuit board and the circuit board for conducting the projection assembly to the circuit board
Implementation Method 2
a base assembly, the base assembly including a circuit board and a base body, the base body being supported by the circuit board
Implementation Method 3
a depth information camera module based on Time of Flight (TOF)... the projection assembly emits a light wave having a specific wavelength band... to solve depth information of the to-be-detected object based on a time difference or a phase difference between the emitted light wave and the received light wave
Data Source
AI summary
Provided are a depth information camera module and a base assembly, a projection assembly, an electronic device and a manufacturing method thereof. The depth information camera module includes: a projection assembly to project a laser to a to-be-detected object; a receiving assembly, including a photosensitive element for receiving the laser reflected from the to-be-detected object; and a base assembly, the base assembly including a circuit board and a base body, the base body being supported by the circuit board, where the photosensitive element is electrically connected to the circuit board, the projection assembly circuit board is supported on a top side of the base body such that the circuit board and the projection assembly circuit board are respectively at different heights of the base assembly. Here, the projection assembly has an integral structure to facilitate assembly of the projection assembly.