ToF Camera Heat Dissipation Structure for 5G Devices
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Electronic devices with Time of Flight (ToF) cameras and 5G communication antennas face challenges in heat dissipation, particularly when heating sources like the light emitter and driver are mounted in a stacked manner, leading to increased heat management difficulties.
Innovation Solution
The implementation of a heat dissipation structure in electronic devices that includes a housing with a front and back plate, an image sensor, a laser emitter, a laser driver, and a heat transfer member system, utilizing a first and second heat transfer member and Thermal Interface Material (TIM) to effectively dissipate heat generated by the ToF camera, even when a 5G communication antenna is present.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the light emitter and driver are mounted in a stacked manner to reduce mounting dimension, then the mounting space is reduced, but the heat dissipation becomes more difficult
Solution Approach 1:
The patent transitions from planar heat dissipation to three-dimensional heat transfer by extending the heat transfer member vertically between the stacked light emitter and driver. This dimensional approach allows heat to be conducted through the thickness direction of the stacked structure, effectively managing thermal loads while maintaining compact mounting dimensions.
Solution Approach 2:
The patent introduces a heat transfer member as an intermediary component between the light emitter and driver. This mediator facilitates thermal energy transfer from the heat-generating elements to external heat dissipation structures, resolving the thermal management challenge created by the stacked mounting configuration.
2Adaptability or versatility
If the 5G communication antenna and driver simultaneously operate, then the communication functionality is enhanced, but the heat generation increases making it difficult to control surface heating
Solution Approach 1:
The patent extracts the heat management function from the overall device structure by implementing a dedicated heat transfer member system. This separate thermal management pathway allows the 5G antenna and driver to operate simultaneously without their combined heat generation compromising surface temperature control.
Solution Approach 2:
The patent applies localized thermal management by positioning the heat transfer member specifically between the heat-generating components (antenna and driver) and the housing. This local quality approach ensures that heat is efficiently extracted from critical areas while maintaining the enhanced communication functionality of the 5G antenna.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enables efficient heat dissipation for ToF cameras in electronic devices with 5G antennas, ensuring that the devices meet surface heating standards and maintain performance by effectively managing heat produced by both the camera and antenna components.
Implementation Method 1
a first heat transfer member, including a first portion disposed between the first metal structure and the driver, a second portion extended from the first portion along an outer face of the housing structure, and a third portion extended from the second portion to a space between the driver and the front plate
Implementation Method 2
a first Thermal Interface Material (TIM) disposed between the second heat transfer member and the front plate, the first TIM being in contact with the second heat transfer member
Data Source
AI summary
An electronic device including a heat-radiant structure of a camera is provided. The electronic device includes a housing including a front plate, a back plate, an image sensor to receive light through a first region of the back plate, and a laser emitter to emit light through a second region of the back plate, a laser driver, a housing structure surrounding at least a part of a side face of the image sensor and driver, a first metal structure, a first heat transfer member including a first portion, a second portion, and a third portion extended from the second portion to a space between the driver and the front plate, a second heat transfer member extended from the third portion of the first heat transfer member, and a first thermal interface material (TIM) disposed between the second heat transfer member and the front plate.