ToF Camera Housing With Integrated EMI Shield and Conductive Traces
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Solution Overview
Problem
Conventional ToF camera packages face challenges with large electromagnetic interference (EMI) shielding that increases the form factor and complicates the assembly process, as the EMI shield is typically larger than the device and not integrated into the package.
Innovation Solution
The integration of an EMI shield and conductive traces into the housing of the ToF camera package using a molded dielectric structural component, which separates the EMI shield from the conductive traces, allowing for a smaller form factor and simplified assembly by enabling passive and active alignment of optical elements.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If a conventional EMI shield is used that is larger than the device and not integrated into the package, then electromagnetic interference protection is provided, but the form factor increases and assembly process becomes complicated
Solution Approach 1:
The EMI shield is merged with the housing structure by integrating it into the molded dielectric component. The housing itself is configured to provide EMI shielding, eliminating the need for a separate, oversized EMI shield component. This integration reduces the overall device volume while maintaining EMI protection functionality.
Solution Approach 2:
The housing structure is designed to serve multiple functions simultaneously: it provides mechanical support, structural integrity, EMI shielding, and optical element mounting. By making the housing multi-functional, the patent eliminates the need for separate dedicated EMI shield components, thereby reducing form factor while maintaining protection capabilities.
2Object-affected harmful factors
If a conventional EMI shield is used that is larger than the device and not integrated into the package, then electromagnetic interference protection is provided, but the assembly process becomes complicated
Solution Approach 1:
The EMI shielding function is combined with the housing structure, reducing the number of discrete components that need to be assembled. The housing is configured to provide EMI protection as an inherent feature rather than requiring a separate assembly step for installing a dedicated EMI shield, thereby simplifying the assembly process.
Solution Approach 2:
The housing is designed as a multi-functional component that simultaneously provides mechanical support, EMI shielding, and optical element mounting capabilities. This multi-functionality reduces assembly complexity by eliminating the need to separately install dedicated EMI shield components and optical mounts.
3Manufacturing precision
If the housing integrates EMI shield and conductive traces separation, then alignment of optical elements is improved, but manufacturing complexity increases
Solution Approach 1:
The housing is segmented into distinct functional regions: an EMI shield portion and a conductive trace portion, separated by a dielectric component. This segmentation allows each region to be optimized for its specific function while maintaining precise alignment through the integrated molded structure. The dielectric separation enables independent optimization of EMI shielding and electrical connection paths.
Solution Approach 2:
The housing utilizes composite material construction with dielectric components separating conductive elements. This composite approach allows the integration of multiple material properties (EMI shielding, electrical conductivity, insulation) within a single molded structure, achieving precise alignment while managing manufacturing complexity through material functionality rather than mechanical complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution reduces the overall size of the ToF camera package and simplifies the assembly process by integrating the EMI shield and conductive traces within the housing, improving the alignment and performance of the electro-optical device.
Implementation Method 1
an electromagnetic interference (EMI) shield; and a plurality of conductive traces, wherein the molded dielectric structural component is configured to separate the EMI shield and the plurality of conductive traces
Data Source
AI summary
In some implementations, a housing for an electro-optical device comprises a molded dielectric structural component, an electromagnetic interference (EMI) shield, and a plurality of conductive traces. The molded dielectric structural component may be configured to separate the EMI shield and the plurality of conductive traces.