Photon Conversion Thin Film for TOF Thermal Imaging
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Solution Overview
Problem
Current thermal imaging technologies face limitations in achieving ultra-thin, high resolution, and low-cost devices due to challenges with pixel size, accuracy, and mass production, particularly with 2D microbolometers and HgCdTe image sensors which require cooling systems, leading to bulky, costly, and power-intensive solutions.
Innovation Solution
An optical device integrating a time-of-flight sensor array, a photon conversion thin film, and a light source, where the photon conversion thin film absorbs short-wavelength photons and emits long-wavelength photons, allowing the time-of-flight sensor to measure temperature differences based on light-achieving time, utilizing materials like silicon, germanium, or organic photodiodes, and employing a light source that emits periodic or modulated light to calculate temperature maps.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If 2D array of microbolometers is used for thermal imaging, then the device can detect long-wavelength infrared radiation, but the pixel size is limited and resolution is reduced due to the bridge structure difficulty to shrink
Solution Approach 1:
The patent replaces the mechanical microbolometer bridge structure with a photon conversion thin film that converts LWIR photons to visible light photons. This substitution eliminates the need for mechanical shrinking of bridge structures while achieving high resolution through the photon conversion mechanism and time-of-flight measurement.
Solution Approach 2:
The patent introduces a photon conversion thin film as an intermediary between the LWIR detector and the visible light detector. This intermediary converts the detected LWIR photons to visible light photons, enabling the use of existing high-resolution visible light sensors while maintaining LWIR detection capability.
2Measurement precision
If HgCdTe LWIR photon to electric conversion layer is used to achieve higher accuracy, then temperature measurement accuracy improves, but the device becomes bulky, expensive, and requires cooling systems
Solution Approach 1:
The patent replaces the complex HgCdTe photon-to-electric conversion layer with a simpler photon conversion thin film that converts LWIR photons to visible light photons. This substitution eliminates the need for cooling systems while maintaining high accuracy through the time-of-flight measurement method.
Solution Approach 2:
The patent uses a inexpensive photon conversion thin film instead of expensive HgCdTe materials. The thin film can be easily manufactured and integrated, eliminating the need for complex cooling systems and reducing overall device cost and complexity.
3Measurement precision
If HgCdTe image sensor is used to achieve high accuracy, then temperature detection accuracy improves, but mass production becomes difficult due to integration challenges with silicon technology
Solution Approach 1:
The patent replaces the HgCdTe image sensor with a photon conversion thin film combined with a visible light sensor. This substitution enables integration with standard silicon technology processes, facilitating mass production while maintaining high accuracy through the time-of-flight measurement method.
Solution Approach 2:
The patent creates a universal solution that works with standard silicon-based visible light sensors while achieving LWIR detection capability through the photon conversion thin film. This multi-functionality enables integration with existing silicon technology and facilitates mass production.
4Ease of manufacture
If 2D microbolometer structure is used, then the device can be manufactured with existing processes, but the bridge structure makes it difficult to shrink, limiting pixel size and resolution
Solution Approach 1:
The patent replaces the mechanical microbolometer bridge structure with a photon conversion thin film approach. This substitution maintains ease of manufacture with existing processes while enabling smaller pixel sizes and higher resolution through the photon conversion and time-of-flight measurement mechanisms.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances temperature resolution, reduces device size, and improves accuracy while eliminating the need for cooling systems, enabling more efficient and cost-effective thermal imaging.
Implementation Method 1
a photon conversion thin film, and a light source. The light source emits light with a first wavelength towards the photon conversion thin film to be converted into light with a second wavelength received by the time-of-flight sensor array. The second wavelength is longer than the first wavelength.
Data Source
AI summary
An optical device is provided. The optical device includes a time-of-flight (TOF) sensor array, a photon conversion thin film, and a light source. The photon conversion thin film is disposed above the time-of-flight sensor array. The light source emits light with a first wavelength towards the photon conversion thin film to be converted into light with a second wavelength received by the time-of-flight sensor array. The second wavelength is longer than the first wavelength.