TOF Projection Module Layout for Shorter Drive Paths and Cooling
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Solution Overview
Problem
Existing TOF camera modules face issues with poor waveform quality of projection light signals due to long wiring distances between the driver chip and the projection unit, leading to increased parasitic inductance. This also results in a thicker module design, poor heat dissipation, and a lack of independent functionality for the transmitting end.
Innovation Solution
The solution involves reducing the wiring distance between the driver chip and the projection unit by placing them on the same side of the circuit board, using a ceramic substrate for improved heat dissipation, and integrating a heat dissipation support to enhance thermal management. Additionally, the transmitting end module is designed to operate independently with a driver IC packaged inside, allowing for direct connection to the mainboard through solder joints.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If the driver chip is disposed on the receiving module or stacked below the projection module to reduce the dimensions of the TOF camera module in the X and Y directions, then the area of the module is reduced, but the wiring distance between the driver chip and the projection unit becomes longer, resulting in poor waveform of the projection light signal
Solution Approach 1:
The driver chip is disposed on the same side of the circuit board as the projection unit, utilizing the planar layout space efficiently. This dimensional arrangement reduces the wiring distance between the driver chip and projection unit while maintaining compact module dimensions in the X and Y directions.
2Area of stationary object
If the driver chip is stacked on the back of the projection module to reduce the dimensions of the TOF camera module, then the area is reduced, but the thickness of the TOF camera module cannot be further reduced, which is disadvantageous to the lightening and thinning of electronic devices
Solution Approach 1:
The driver chip and projection unit are both disposed on the same side of the circuit board, utilizing the planar layout space efficiently. This dimensional arrangement reduces the wiring distance between the driver chip and projection unit while maintaining compact module dimensions in the X and Y directions.
3Area of stationary object
If the driver chip is disposed on the receiving module or stacked below the projection module, then the area is reduced, but the heat dissipation performance of the TOF camera module becomes poor, and the high temperature of the projection module affects the optical power and service life
Solution Approach 1:
The driver chip is extracted from the receiving module and disposed separately on the same side of the circuit board as the projection unit. This separation allows for independent thermal management and heat dissipation design, preventing heat accumulation that would otherwise affect optical power and service life.
4Device complexity
If the transmitting end and receiving end are assembled into one body with the driver chip packaged in the receiving end, then the integration is improved, but the transmitting end cannot work independently and cannot emit a light signal of a specific waveform
Solution Approach 1:
The TOF camera module is segmented into a transmitting end module and a receiving end module that can be independently disposed on the circuit board. The driver chip is integrated with the transmitting end, allowing the transmitting end to work independently and emit light signals of specific waveforms, while maintaining overall system integration.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration improves the pulse waveform quality and signal-to-noise ratio of the projection light signal, reduces the overall thickness of the camera module, enhances heat dissipation, and allows for independent operation of the transmitting end module.
Implementation Method 1
reducing a wiring distance between a driver chip and a projection unit of a projection module of the TOF camera module, the parasitic inductance of the projection module is reduced, the pulse waveform quality of the light signal projected by the projection unit is improved
Implementation Method 2
using a ceramic substrate for improved heat dissipation
Data Source
AI summary
The present invention provides a TOF camera module and a projection module thereof, and an electronic device, wherein the TOF camera module comprises a projection module and a receiving module, wherein the projection unit of the projection module is controlled by the driver chip to project detection light, and wherein the receiving module is disposed adjacent to the projection module, the receiving module receives reflected light of the detection light, and obtains depth information of an illuminated object based on the reflected light. The projection module comprises a transmitting circuit board, a support, an optical element, at least one projection unit and at least one driver chip, wherein the driver chip is conductively connected to the transmitting circuit board, and the driver chip controls the projection unit through the transmitting circuit board, and wherein the driver chip and the projection unit are located on the same side of the transmitting circuit board.