Integrated TOF RGB-IR Sensor Array for Depth-Color Alignment
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Solution Overview
Problem
Existing TOF 3D cameras and RGB cameras in separate sensor arrays face alignment and calibration issues, leading to occlusion and increased device size and cost, due to different light axes and separate sensor arrays.
Innovation Solution
A three-dimensional TOF RGB-IR image sensor with a single sensor array that integrates time-of-flight and color sensing, using a filter array with both infrared and visible-light-transmitting bandpass filters, allowing simultaneous alignment and avoiding occlusion.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If separate sensor arrays are used for TOF 3D camera and RGB camera, then each camera can be independently designed, but alignment and calibration become problematic due to different light axes
Solution Approach 1:
The patent combines TOF and RGB sensing capabilities into a single integrated sensor array where both sensor types share common optical path and light axis. This merging eliminates alignment and calibration problems between separate cameras while maintaining independent design flexibility through modular sensor elements within the unified array.
2Adaptability or versatility
If separate sensor arrays are used for TOF 3D camera and RGB camera, then each sensor can operate independently, but occlusion between cameras occurs
Solution Approach 1:
By integrating TOF and RGB sensors into a single co-located array, the patent eliminates mutual occlusion between separate cameras. Both sensor types observe the same scene from identical position and angle, ensuring complete field of view coverage while maintaining independent sensing operations through wavelength-selective detection.
3Adaptability or versatility
If separate sensor arrays are used for TOF 3D camera and RGB camera, then functional specialization is achieved, but device size increases
Solution Approach 1:
The patent merges TOF and RGB sensing functions into a single compact sensor array, dramatically reducing device size compared to separate camera systems. The integrated design shares common optical components, sensor substrate, and processing electronics, achieving space efficiency while preserving specialized sensing capabilities through wavelength-multiplexed detection.
Solution Approach 2:
The unified sensor array performs multiple functions simultaneously - both TOF depth measurement and RGB color imaging - using a single multi-functional platform. Each pixel element can detect different wavelengths, enabling the same physical sensor to execute diverse sensing tasks without requiring separate dedicated hardware for each function.
4Adaptability or versatility
If separate sensor arrays are used for TOF 3D camera and RGB camera, then dedicated optimization for each function is possible, but manufacturing cost increases
Solution Approach 1:
The patent consolidates manufacturing processes by producing TOF and RGB sensors together in a single integrated array fabrication run. This approach leverages shared manufacturing infrastructure, common materials, and unified assembly procedures, reducing per-unit costs compared to producing separate camera systems while maintaining optimized performance for both sensing modalities through specialized pixel designs within the unified array.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables precise alignment and calibration of RGB and depth information, reducing device size and cost by eliminating the need for separate sensor arrays.
Implementation Method 1
A three-dimensional TOF RGB-IR image sensor with a single sensor array that integrates time-of-flight and color sensing, using a filter array with both infrared and visible-light-transmitting bandpass filters
Implementation Method 2
The filter array includes a plurality of photodetector cells arranged in a grid pattern and positioned adjacent to the wiring layer
Data Source
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AI summary
A three-dimensional time-of-flight (TOF) RGB-IR image sensor is provided, including a signal generator configured to generate a modulated electrical signal. The three-dimensional TOF RGB-IR image sensor may further include a light-emitting diode (LED) configured to receive the modulated electrical signal and emit modulated light. The three-dimensional TOF RGB-IR image sensor may further include a TOF sensor integrated circuit configured to receive light at the light-receiving surface and generate a photoelectrical signal based on the received light. The received light may include ambient light and reflected modulated light. The three-dimensional TOF RGB-IR image sensor may further include a filter array located on the light-receiving surface of the TOF sensor integrated circuit. The filter array may include a plurality of pixels, each pixel including an infrared-transmitting bandpass filter and one or more visible-light-transmitting bandpass filters located adjacent to the infrared-transmitting bandpass filter.