Resin-Embedded Time-of-Flight Sensor for Coplanar Optical Alignment
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Solution Overview
Problem
Existing time-of-flight sensors face challenges in design and manufacturing that affect their accuracy and compactness, particularly in the integration of light ray generation and reception circuits within a resin layer.
Innovation Solution
The integration of light ray generation and reception circuits within a resin layer, with specific regions flush with a common surface, covered by insulating layers and conductive tracks, and optical instruments embedded within resin components, utilizing panel embedded packaging (PEP) technology for compact and efficient design.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If light ray generation and reception circuits are integrated within a resin layer, then compactness and manufacturing efficiency are improved, but manufacturing precision and alignment accuracy may deteriorate
Solution Approach 1:
The patent applies preliminary action by pre-defining the positions of the light ray generation circuit and reception circuit within the resin layer during the manufacturing process. The circuits are positioned at predetermined locations before the resin is cured, ensuring accurate alignment while maintaining compact integration. This allows the circuits to be flush with the resin surface, facilitating precise optical alignment without requiring post-manufacturing adjustments.
Solution Approach 2:
The resin layer acts as an intermediary medium that holds both the light ray generation and reception circuits in precise relative positions. The resin provides mechanical support and maintains the spatial relationship between the circuits, enabling accurate alignment while allowing for compact integration within a single layer structure.
2Device complexity
If the first and second circuits are located in a first resin layer with flush regions, then device complexity is reduced, but structural stability may worsen
Solution Approach 1:
The patent merges the light ray generation circuit and reception circuit into a single resin layer, reducing device complexity by eliminating the need for separate layers or complex assembly processes. Both circuits are embedded within the same resin matrix, simplifying the overall structure while maintaining functional integrity through careful positioning of flush regions.
Solution Approach 2:
The resin layer functions as a flexible encapsulating medium that provides structural stability while accommodating the integrated circuits. The resin's mechanical properties allow it to hold the circuits in place and protect them, maintaining structural integrity despite the simplified single-layer design.
3Ease of manufacture
If optical instruments are embedded in resin components with openings, then ease of manufacture is improved, but optical precision may deteriorate
Solution Approach 1:
The patent applies the nested doll principle by embedding optical instruments within resin components that have openings. The optical instruments are positioned inside the resin structure, with openings providing access for light rays. This nested arrangement simplifies manufacturing by integrating multiple components into a single unit while maintaining optical precision through carefully designed opening positions and sizes.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables a compact, resistant, and efficient time-of-flight sensor with coplanar ray emission and reception regions, enhancing accuracy and manufacturing efficiency.
Implementation Method 1
a first light ray generation circuit (12) configured to emit light rays (15) towards a scene
Implementation Method 2
a second light ray reception circuit (14) configured to receive light rays (15) reflected by a scene
Implementation Method 3
the first and second circuits being located in a first resin layer (20)
Data Source
AI summary
A time-of-flight sensor includes a first light ray generation circuit and a second light ray reception circuit. A resin layer encapsulates the first light ray generation circuit and the second light ray reception circuit. A first region configured to emit light rays of the first light ray generation circuit is exposed at a surface of the resin layer. A second region configured to receive light rays of the second light ray reception circuit is also exposed at that surface of the resin layer. The surface of the resin layer is configured to be directed towards a scene.