Tolerance Compensation Element for DCB Substrate Gap Control
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Solution Overview
Problem
In power electronics, the production tolerances of PCBs and material properties lead to inconsistent semiconductor component heights, causing unreliable contacting and issues with solder application, which affects insulation, conductivity, and increases production costs due to the need for individual measurement and solder application.
Innovation Solution
A tolerance compensation element is introduced using additive manufacturing to close the gap between a DCB substrate and a PCB, applying a material that can be wetted by conventional solder, ensuring reliable contacting and adaptable to specific component pairs through a closed control loop.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional PCB manufacturing with milling is used, then production volume can be maintained, but gap dimensions cannot be controlled within required tolerances due to milling tolerances and material properties
Solution Approach 1:
The cavity depth is predetermined during PCB manufacturing with a standard tolerance (e.g., ±50 μm), and a tolerance compensation element is pre-positioned to make up the difference. This preliminary action allows the majority of PCBs to be manufactured without individual measurement, maintaining high productivity while achieving the required final gap precision through the compensation element.
Solution Approach 2:
The invention changes the parameter control approach from controlling the cavity depth directly (which is difficult due to milling tolerances) to controlling the compensation element thickness. The compensation element is manufactured with precise thickness control (e.g., ±10 μm or better) using techniques like precision machining or controlled deposition, thereby achieving the required gap precision through parameter transformation.
2Manufacturing precision
If individual measurement and solder application is performed for each component, then gap dimensions can be precisely controlled, but production costs increase and throughput time decreases
Solution Approach 1:
The tolerance compensation element is pre-manufactured with the required thickness precision and pre-positioned on the PCB or component holder before the main assembly process. This preliminary preparation eliminates the need for individual measurement and adjustment during production, reducing cycle time while maintaining precision.
Solution Approach 2:
The compensation element is designed to be self-adjusting within a range, accommodating variations in component height without requiring precise measurement. The element compensates for tolerances automatically through its design (e.g., compressible material or adjustable thickness), eliminating the need for time-consuming individual measurement and adjustment operations.
3Reliability
If solder is applied to close large gaps (>100 μm), then contacting can be achieved, but thermal and electrical conductivities are impaired due to insufficient solder
Solution Approach 1:
The tolerance compensation element acts as an intermediary between the PCB and the semiconductor component, providing a mechanically stable foundation that maintains consistent gap dimensions. This intermediary ensures that the solder joint forms over a controlled, consistent distance, guaranteeing reliable electrical and thermal conductivity without the variability associated with large, uncontrolled gaps.
4Reliability
If the cavity depth is adapted to each semiconductor component, then contacting reliability improves, but the variety of PCB variants increases and costs decrease
Solution Approach 1:
The tolerance compensation element provides a universal solution that can be used with multiple semiconductor component types and height variations. Instead of creating different PCB cavity depths for each component type, the same PCB design with standard tolerances can accommodate various components by using appropriately sized compensation elements, thereby reducing PCB variant complexity while maintaining contacting reliability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution ensures reliable electrical contacting by maintaining precise gap dimensions, improving insulation and conductivity while reducing production costs by eliminating the need for individual solder application and measurement processes.
Implementation Method 1
a tolerance compensation element is specifically set between the DCB substrate and the PCB circuit board in a gap A for the contacting of components on the DCB substrate by means of additive manufacturing and is formed in a gap-closing manner
Implementation Method 2
applying a material that can be wetted by conventional solder, ensuring reliable contacting
Data Source
AI summary
A tolerance compensation element is for circuit configurations having a DCB (direct copper bonded) substrate and a PCB (printed circuit board). A circuit configuration further includes the tolerance compensation element. A tolerance compensation element is positioned in a targeted manner between the DCB substrate and PCB in a gap A for the contact-connection of components on the DCB substrate via additive manufacturing and is formed so as to close the gap.