Tool-Free Module Holder for Heating and Cooling Ceiling Assembly
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Solution Overview
Problem
Existing heating and cooling ceiling arrangements face reduced heating and cooling capacity due to the space occupied by drywall profiles and complex installation processes, which also require multiple pipe connections increasing installation effort.
Innovation Solution
A module holder with tool-free, detachable attachment areas for modules to ceiling substructures, allowing for efficient coverage of the ceiling surface without screws, and enabling simplified installation by using elastic, one-piece components that can be produced via injection molding.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If modules are arranged between the profiles of the fine grid and fastened using screw connections via cladding, then the modules can be securely attached to the ceiling substructure, but the active surface area is reduced and the assembly process becomes complex
Solution Approach 1:
The invention extracts the attachment function from the cladding system and integrates it directly into the module structure through attachment projections that engage with the ceiling substructure profiles. This eliminates the need for separate cladding components and screw connections, allowing modules to be mounted directly to the profiles without reducing the active surface area.
Solution Approach 2:
The attachment projections are pre-formed as integral parts of the modules during manufacturing. This preliminary integration of the attachment mechanism eliminates the need for complex assembly operations involving cladding and screws, simplifying the installation process while maintaining secure attachment.
2Reliability
If modules are arranged between the profiles of the fine grid, then the modules can be attached to the ceiling substructure, but the heating and cooling capacity is reduced due to the space occupied by the profiles
Solution Approach 1:
The invention extracts the modules from the constrained positions between the fine grid profiles and allows them to be mounted directly to the ceiling substructure profiles. This repositioning eliminates the space loss caused by the fine grid profiles, maximizing the active surface area and thereby increasing the heating and cooling capacity while maintaining structural support through direct profile attachment.
3Reliability
If screw connections are used to fasten modules via cladding to the profiles, then secure attachment is achieved, but the installation effort and time are increased
Solution Approach 1:
The invention extracts the attachment mechanism from the complex cladding and screw connection system and simplifies it to integrated attachment projections that directly engage with the ceiling substructure profiles. This streamlined approach maintains secure attachment while dramatically reducing installation time and effort by eliminating multiple assembly steps.
Solution Approach 2:
The attachment projections are designed to self-align and self-lock into the ceiling substructure profiles without requiring external fastening operations. This self-service attachment mechanism eliminates the need for screw drivers and multiple fastening steps, reducing installation time while ensuring reliable attachment.
4Adaptability or versatility
If pipe connections are made on each module to accommodate the fine grid structure, then the modules can be integrated into the ceiling system, but the installation effort is increased
Solution Approach 1:
The invention creates a universal attachment system where the attachment projections serve both structural support and integration functions. This multi-functional design allows consistent integration with the ceiling substructure across all modules, simplifying the overall system complexity despite the presence of multiple modules.
Data Source
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AI summary
A mounting bracket for the detachable attachment of a module (2) for cooling and/or heating to a ceiling substructure is proposed, wherein a module holder (1) is provided with a first mounting area (4) for tool-free attachment to the module (2) and with a second mounting area (5) for tool-free attachment to a profile (3) of the ceiling substructure. Furthermore, a plate-shaped module (2) for receiving a continuous pipe carrying a medium for cooling and/or heating is proposed, wherein at least one locking recess (8) is provided for the detachable and tool-free receipt of a module holder (1). In addition, a heating and/or cooling ceiling arrangement on a ceiling substructure with drywall profiles and with several modules (2) detachably and tool-free attached to the drywall profiles via several module holders is also proposed.