Tool Image Inspection for Chip Entanglement Replacement Decisions
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Solution Overview
Problem
Existing machine tool inspection technologies face challenges in accurately determining when to replace tools due to entangled chips, as current methods are time-consuming and lack precision in assessing the amount of chips, leading to potential damage to workpieces or reduced machining efficiency.
Innovation Solution
An image processing device that captures images of tools from multiple angles, calculates the excess area or number of different pixels between reference and used tool images, and judges tool suitability for continuous use based on predetermined thresholds, enabling timely and accurate decision-making for tool replacement.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If manual inspection of chip entanglement is performed, then the user can assess tool condition, but the inspection process is time-consuming and lacks precision
Solution Approach 1:
The patent replaces manual visual inspection with an automated image processing system that captures images of the tool and workpiece, then uses image processing algorithms to automatically detect and measure chip entanglement. This substitution of mechanical/manual inspection with automated optical-mechanical systems resolves the contradiction by providing precise measurements without time loss.
Solution Approach 2:
The system enables self-inspection by having the machining device automatically capture images and process them to assess chip entanglement during or after machining operations. The device inspects itself without requiring separate manual intervention, thus eliminating inspection time loss while maintaining high precision through automated image analysis.
2Reliability
If tool replacement is performed frequently to prevent chip entanglement issues, then workpiece damage is prevented, but machining efficiency decreases due to excessive tool changes
Solution Approach 1:
The patent implements a feedback mechanism where the image processing system continuously monitors chip entanglement levels and provides information about tool condition. This feedback allows the system to make informed decisions about when tool replacement is actually necessary, rather than following fixed schedules. The feedback loop ensures workpiece quality is maintained while avoiding unnecessary tool changes that would reduce productivity.
Solution Approach 2:
The system changes the parameter of tool replacement timing from fixed/preventive to condition-based/dynamic. By using image processing to measure actual chip entanglement levels, the system adjusts the replacement decision based on real-time tool condition parameters rather than predetermined intervals, thus maintaining reliability while optimizing productivity.
3Duration of action of moving object
If manual chip removal is performed after machining, then tool reusability is improved, but additional time and labor are required
Solution Approach 1:
The patent performs preliminary inspection of chip entanglement using image processing before the tool is fully utilized or before manual chip removal would be needed. By detecting chip entanglement early through automated imaging, the system can plan and time chip removal operations more efficiently, extending tool service life without adding significant time loss by integrating the inspection into the existing machining workflow.
Data Source
AI summary
The image processing device includes a reception unit that receives an image of a tool from a camera of a machine tool, an area calculation unit that calculates an excess area that is an area of a region corresponding to the tool in the captured image that is at least a predetermined distance away from a tool center, and an inspection unit that judges the suitability of the tool for continuous use based on the size of the excess area.