Toothed Slider High Density Head Gimbal Assembly Interconnect
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Solution Overview
Problem
In high-density slider configurations for data storage disk drives, the traditional single-row solder interconnects often result in inadequate separation between adjacent connections, leading to bridging or open connections due to solder ball expansion and inherent trajectory errors, which worsens with increased numbers of slider pads beyond standard configurations.
Innovation Solution
The slider configuration features a 'toothed' trailing surface with protrusions and recessed bond pads arranged in multiple rows, increasing interconnect density and separation between adjacent connections, reducing the risk of solder bridging while maintaining reliable connections through larger solder volumes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If trailing slider surface interconnects are arranged in a single row, then the manufacturing process is simple, but the separation between adjacent interconnects is inadequate leading to bridging or open connections
Solution Approach 1:
The patent transitions from a single-row arrangement of solder interconnects to a multi-row arrangement by utilizing the toothed structure of the slider trailing surface. Protrusions and recesses create multiple levels for bond pad placement, effectively adding a spatial dimension to the interconnect arrangement. This dimensional change increases separation between adjacent interconnects while maintaining high interconnect density, thereby preventing solder bridging and improving connection reliability.
2Productivity
If the number of slider pads is increased beyond standard configurations, then the interconnect density is increased, but the risk of solder bridging increases due to inadequate separation
Solution Approach 1:
The patent segments the trailing slider surface into multiple regions with protrusions and recesses, creating distinct zones for different bond pads. This segmentation allows high interconnect density while maintaining adequate separation between adjacent interconnects. The toothed structure divides the continuous surface into discrete, well-separated platforms for solder ball placement, preventing bridging even as the number of pads increases.
Solution Approach 2:
By utilizing the vertical dimension through protrusions and recesses, the patent achieves multi-row interconnect arrangement. This allows increasing the number of slider pads beyond standard configurations while maintaining physical separation through the third dimension, thereby preventing solder bridging and improving reliability.
3Strength
If solder ball volume is increased to improve joint strength, then the connection reliability improves, but the risk of solder bridging between adjacent interconnects increases
Solution Approach 1:
The toothed structure segments the solder application areas into distinct protrusion and recess zones. This segmentation allows each solder ball to be appropriately sized for its specific location while maintaining overall adequate separation. The physical division into multiple levels prevents solder from flowing continuously between adjacent interconnects, enabling use of sufficient solder volume for strength without causing bridging.
Solution Approach 2:
The protrusions and recesses act as intermediary structural elements between adjacent interconnects. These features create physical barriers that control solder flow and distribution, allowing adequate solder volume for strong joints while preventing solder from bridging between separate interconnect locations. The toothed structure serves as a mediator that enables both strong connections and adequate separation.
Data Source
AI summary
A slider for use in a disk drive, the slider including a slider body having a leading surface and an opposite trailing surface, wherein the trailing surface includes portions with extensions or depressions. The extensions or depressions include a slider bond pad.