Top-Gate TFT Doping Layout for Lower Contact Resistance

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Solution Overview

Problem

Top-gate thin film transistors (TFTs) suffer from high contact resistance, which hinders their performance in various electronic applications.

Innovation Solution

A sheet of doping is introduced on the top surface of the TFT channel material to improve contact resistance, comprising specific dielectric and metal layers with precise thickness and material compositions to enhance the transistor's efficiency.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If top-gate TFT configuration is used, then low-temperature fabrication is achieved, but contact resistance increases

Engineering Contradiction:
Improvefabrication temperatureVSAvoidcontact resistance
Core Design Contradiction:
TemperatureVSReliability

Solution Approach 1:

The patent applies local quality by creating a doped region specifically at the top surface of the channel material where contacts are formed. This localized doping concentrates the conductivity enhancement exactly where contact resistance is the problem, while leaving the rest of the channel material undoped to maintain its original properties and low-temperature fabrication compatibility.

Inventive Principle:
Principle #3Local quality

Solution Approach 2:

The patent changes the electrical parameter (conductivity) of the channel material by introducing dopants. This modifies the carrier concentration and conductivity in the doped region, directly addressing the contact resistance issue without changing the fundamental top-gate TFT structure or requiring high-temperature processing.

Inventive Principle:
Principle #35Parameter changes

2Reliability

If doping is introduced on top surface of channel material, then contact resistance is reduced, but device complexity increases

Engineering Contradiction:
Improvecontact resistanceVSAvoidfabrication process complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The patent applies preliminary action by performing the doping step before contact formation. The doped region is prepared in advance, ensuring optimal conductivity conditions are established before the contacts are deposited and patterned. This sequencing simplifies the overall process by preparing the channel material in advance rather than requiring additional processing steps after contact formation.

Inventive Principle:
Principle #10Preliminary action

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The doping on the top surface of the TFT channel material significantly reduces contact resistance, leading to improved performance and efficiency in TFTs, making them suitable for applications in mobile computing platforms and data server machines.

Implementation Method 1

A sheet of doping is introduced on the top surface of the TFT channel material to improve contact resistance

Methodology Applied
Scientific EffectDoping: Dopants

Data Source

PatentUS11862730B2Top-gate doped thin film transistor
Publication Date: 2024.01.02 INTEL CORP
  • US11862730B2 patent drawing
  • US11862730B2 patent drawing
  • US11862730B2 patent drawing

AI summary

Described is a thin film transistor which comprises: a dielectric comprising a dielectric material; a first structure adjacent to the dielectric, the first structure comprising a first material; a second structure adjacent to the first structure, the second structure comprising a second material wherein the second material is doped; a second dielectric adjacent to the second structure; a gate comprising a metal adjacent to the second dielectric; a spacer partially adjacent to the gate and the second dielectric; and a contact adjacent to the spacer.