Top-Hat Rail Electric Assembly Thermal Dissipation
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Solution Overview
Problem
Electrical assemblies with printed circuit boards face challenges in thermal dissipation due to limited thermal conductivity, requiring additional heat sinks that complicate assembly and increase space usage.
Innovation Solution
An electrical assembly featuring a multi-layer carrier with a thermally conductive metal plate and a thermally conductive dielectric layer, eliminating the need for additional heat sinks by effectively dissipating thermal energy, while also providing electromagnetic shielding.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If additional heat sinks are used to dissipate thermal energy, then thermal dissipation is improved, but device complexity and assembly difficulty increase
Solution Approach 1:
The patent combines the heat dissipation function with the existing metal plate structure by creating a thermally conductive connection between the power supply component and the metal plate. This integration eliminates the need for separate heat sinks while maintaining effective thermal management through the metal plate's inherent thermal conductivity.
Solution Approach 2:
The metal plate is designed to serve multiple functions: it provides structural support, electromagnetic shielding, and thermal dissipation. By making the metal plate thermally conductive, it simultaneously performs cooling without requiring additional dedicated cooling components, thus reducing overall device complexity.
2Temperature
If additional heat sinks are installed, then thermal dissipation is improved, but installation space increases
Solution Approach 1:
The cooling function is merged into the existing metal plate structure rather than adding separate heat sink components. This integration allows thermal dissipation to occur within the same spatial footprint as the original design, eliminating the need for additional space that would be required for separate heat sinks.
Solution Approach 2:
The metal plate itself serves as the heat dissipation medium through its inherent thermal conductivity. By establishing a thermally conductive connection, the metal plate performs self-cooling without requiring external heat sink components, thereby maintaining compact installation space.
3Reliability
If phenolic resin or epoxy resin carrier materials are used, then electrical insulation is provided, but thermal conductivity is limited
Solution Approach 1:
The patent introduces a thermally conductive adhesive layer as an intermediary between the power supply component and the metal plate. This adhesive layer maintains electrical insulation properties while providing a thermally conductive pathway, effectively bridging the gap between the electrically insulating carrier material and the thermally conductive metal plate.
Solution Approach 2:
The solution employs a composite structure combining the electrically insulating carrier material (phenolic or epoxy resin) with a thermally conductive adhesive layer and metal plate. This composite approach allows the system to simultaneously achieve electrical insulation from the resin and thermal conductivity through the adhesive and metal plate combination.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enhances thermal dissipation and reduces installation space, allowing for easier assembly and operation in EMC-sensitive environments without additional heat sinks, improving cooling efficiency and shielding electromagnetic interference.
Implementation Method 1
the electrical power supply component is thermally conductively connected to the metal plate to dissipate thermal energy from the electrical power supply component
Implementation Method 2
an electrical insulation layer which is arranged between the metal plate and the conductor track layer
Data Source
Figure 1~2
Figure 3~4
Figure 5~6
AI summary
The invention relates to an electric assembly to be mounted on a top-hat rail, comprising: an electric current supply component (200): a multi-layered support (206) comprising a metal plate (300), a conductive layer (302) for electrically contacting the electric current supply component (200) and an electric insulation layer (304) which is arranged between the metal plate (300) and the conductive layer (302); said electric current supply component (200) is connected in an heat-conductive manner to the metal plate (300) in order to withdraw thermal energy from the electric current supply component (200).