Integrated Top Lid Support for Thermal Sag in Substrate Processing

Resolve Bottlenecks,
Find Innovative Solutions
Generate Solutions

Solution Overview

Problem

The top lid of substrate processing apparatuses sag due to negative pressure and thermal deformation, leading to non-uniform gas flow and plasma distribution, and increase device complexity.

Innovation Solution

The top lid is integrated with a support formed from the same material, featuring a cross-shaped design with symmetric protrusions to minimize thermal deformation, and lacks separate connection devices, maintaining a constant distance between gas supply units and substrate supports.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Stability of the object's composition

If a support is installed in a vertical direction between the chamber wall and the top lid to prevent sagging, then the top lid deformation is reduced, but the device complexity increases and interference may occur between reactors during substrate transfer

Engineering Contradiction:
Improvetop lid deformationVSAvoiddevice configuration complexity
Core Design Contradiction:
Stability of the object's compositionVSDevice complexity

Solution Approach 1:

The support is integrated into the top lid as an integral structure rather than being a separate component. The support protrudes from the upper surface of the top lid and is formed as a single piece with the top lid itself, eliminating the need for separate connection devices and reducing device complexity while maintaining the sagging prevention function

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The integrated support structure serves multiple functions: it provides mechanical support to prevent top lid sagging under vacuum pressure, maintains the structural integrity of the top lid, and eliminates the need for separate connection devices. This multi-functional design reduces the overall device complexity

Inventive Principle:
Principle #6Universality (Multi-functionality)

2Stability of the object's composition

If the top lid is made thicker to prevent thermal deformation, then the thermal stability is improved, but the weight and device complexity increase

Engineering Contradiction:
Improvethermal deformationVSAvoidtop lid weight
Core Design Contradiction:
Stability of the object's compositionVSWeight of stationary object

Solution Approach 1:

Instead of uniformly increasing the thickness of the entire top lid, the support structure is strategically positioned at specific locations where thermal deformation and vacuum pressure effects are most pronounced. The support protrudes from the upper surface at key structural points, providing localized reinforcement that prevents thermal deformation without adding excessive weight throughout the entire top lid

Inventive Principle:
Principle #3Local quality

Solution Approach 2:

The top lid and support are formed as an integral structure from the same material, ensuring uniform thermal expansion properties and eliminating interface issues. This integrated design provides optimal thermal stability while maintaining weight efficiency through the strategic placement of support structures

Inventive Principle:
Principle #40Composite materials

3Strength

If connection devices are used to attach the support to the top lid, then the support can be securely fixed, but the device complexity increases and thermal expansion differences may cause connection failures

Engineering Contradiction:
Improvesupport fixation strengthVSAvoidconnection device complexity
Core Design Contradiction:
StrengthVSDevice complexity

Solution Approach 1:

The support and top lid are formed as a single integral structure without any connection devices. The support protrudes directly from the upper surface of the top lid as part of the same piece, eliminating grooves, fasteners, or other connection mechanisms. This integration ensures perfect thermal expansion compatibility and eliminates connection failure risks while reducing device complexity

Inventive Principle:
Principle #5Merging (Combining)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The integrated support design maintains a consistent reaction space distance, ensuring uniform gas flow and plasma distribution, reducing device complexity and process defects.

Implementation Method 1

the top lid 3 may sag due to a negative pressure (i.e., vacuum suction power) of the inner space 8 generated by the exhaust unit (not shown) such as a vacuum pump

Methodology Applied
Scientific EffectNegative pressure (vacuum suction): Vacuum

Implementation Method 2

when a substrate is processed at a high temperature, the top lid 3 may further sag due to thermal deformation

Methodology Applied
Scientific EffectThermal deformation: Thermal Expansion

Data Source

PatentUS20260076138A1Substrate processing apparatus
Publication Date: 2026.03.12 ASM IP HLDG BV
  • US20260076138A1 patent drawing
  • US20260076138A1 patent drawing
  • US20260076138A1 patent drawing

AI summary

A top lid capable of minimizing thermal deformation when a substrate processing temperature increases includes a support for supporting the top lid, the support protruding integrally from one surface of the top lid.