Top-Loading Wafer Device for Hexagonal Platform Space Optimization
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional equipment platform systems for semiconductor IC manufacturing are inefficient in utilizing space and reducing production costs, as they limit the number of process chambers due to wafer loading chamber configurations, leading to decreased wafer transfer efficiency and increased production costs.
Innovation Solution
The introduction of a top-loading wafer device with a central robot, loading gate, wafer tray, and shutoff gate allows for direct transfer of wafers between the wafer loading unit and the working platform, maintaining a vacuum state and enabling more process chambers to be mounted on the hexagonal working platform, thereby increasing transfer efficiency and throughput.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If wafer loading chambers are mounted at the sides of the hexagonal working platform, then wafer loading can be performed, but the number of process chambers that can be mounted is limited to one to four
Solution Approach 1:
The patent introduces a top-loading wafer device that utilizes the vertical dimension (top surface) of the hexagonal working platform for wafer loading, rather than only the horizontal side mounting. This dimensional change allows process chambers to be mounted at all six sides while wafer loading occurs from the top, resolving the spatial conflict and enabling maximum process chamber capacity.
2Productivity
If more process chambers are mounted on the working platform, then uninterrupted multi-step processing can be achieved, but the conventional side-mounted wafer loading chambers occupy mounting positions
Solution Approach 1:
The invention moves the wafer loading function from the horizontal plane (side mounting) to the vertical dimension (top loading). The top-loading wafer device is fixed at the top surface of the working platform, allowing all six sides to be available for process chamber mounting while wafer loading occurs from above, thus maximizing both throughput and space utilization.
Solution Approach 2:
The top-loading wafer device acts as an intermediary mechanism that enables wafer transfer without occupying side mounting positions. It includes a wafer tray that can be lowered through an opening in the top surface to transfer wafers to process chambers, serving as a mediator between the external wafer source and the process chambers mounted at all six sides.
3Productivity
If a top-loading wafer device is introduced, then more process chambers can be mounted and transfer efficiency increases, but the device complexity increases
Solution Approach 1:
The top-loading wafer device is designed to perform multiple functions: it holds multiple wafers on a tray, provides vacuum sealing through gates, enables transfer to multiple process chambers, and maintains vacuum integrity. This multi-functionality consolidates what would otherwise require multiple separate systems into a single integrated device, managing complexity while maximizing productivity.
Data Source
AI summary
An equipment platform system and a wafer transfer method used to a wafer processing is provided. The equipment platform system comprises: a working platform, each side of the working platform is used to mount process chamber; a top-loading wafer device fixed on the top surface of working platform, the top-loading wafer device includes: a cassette or FOUP loading unit, a wafer loading unit installed disposed opposite the cassette or FOUP loading unit, the wafer loading unit has an inside cavity; a central robot, located between the cassette or FOUP loading unit and the wafer loading unit; a loading gate used to open or close the inside cavity; a wafer tray, which is in the inside cavity; a shutoff gate, which is at the bottom of the inside cavity, used to open or close the internal of the working platform; there is an opening at the top of the working platform, the opening is located at the lower part of the inside cavity, and disposed opposite the shutoff gate, the shutoff gate can seal the opening. The equipment platform system of the invention can decrease the floor space, increase the space efficiency, and the wafer transfer efficiency.