Top-Mount Board Connector Architecture for Slim, Low-EMF Modules
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Solution Overview
Problem
Traditional solutions for connecting add-in boards to motherboards in slim computing devices result in unwanted electromagnetic frequency discharge and are costly to manufacture, limiting design flexibility and compliance with EMF regulations, while also being height-constrained.
Innovation Solution
The development of ultra slim module (USM) connectors, including inline and top mount USM connectors with a low profile design, which use electrical leads and alignment frames to securely connect add-in boards with screw holes for alignment and grounding, reducing EMF discharge and allowing for thinner device profiles.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If traditional connection solutions are used to connect add-in boards to motherboards, then connection reliability is achieved, but electromagnetic frequency discharge occurs and manufacturing cost increases
Solution Approach 1:
The patent changes the physical and electrical parameters of the connector by using a lead frame structure with specific trace configurations, ground contact arrangements, and contact force distributions. These parameter changes enable the connector to maintain reliable electrical connection while reducing electromagnetic frequency discharge through optimized trace routing and ground shielding.
2Stability of the object's composition
If traditional connection solutions are used, then connection stability is maintained, but device height increases and manufacturing cost increases
Solution Approach 1:
The patent replaces traditional mechanical connector structures with a lead frame-based electrical connection system. The lead frame provides both mechanical support and electrical connection in an integrated structure, eliminating the need for separate mechanical fastening components and reducing overall device height while maintaining connection stability through the flexibility and compliance of the lead frame material.
3Object-affected harmful factors
If custom connection solutions are developed to reduce EMF discharge, then EMF compliance is achieved, but manufacturing cost increases and manufacturing complexity increases
Solution Approach 1:
The lead frame structure serves multiple functions simultaneously: it provides electrical connection, electromagnetic shielding, mechanical support, and alignment guidance. This multi-functionality allows a single component to address EMF discharge concerns while maintaining ease of manufacture through standardized lead frame fabrication processes and integration with existing PCB assembly techniques.
4Length of stationary object
If low profile connectors are used to reduce device height, then device thickness is reduced, but connection reliability may be compromised
Solution Approach 1:
The lead frame is designed with dynamic compliance characteristics that allow it to flex and adapt during assembly and operation. This dynamic behavior enables the low-profile connector to maintain reliable electrical contact despite variations in assembly tolerances, board warpage, or thermal expansion, while keeping the overall device thickness minimized.
Data Source
AI summary
A board-to-board connector includes electrical leads to bridge from one board to another board, to interconnect pads on one surface of the boards. The boards can interconnect while one board is vertically offset from the other board with a top mount connector. The connector includes a lead frame having the electrical leads and the connector includes an alignment frame to hold the lead frame. The lead frame includes leads that have contact arms that are vertically offset from each other. The connector includes a conductive case to secure over the alignment frame. The connector includes screw holes to allow screws to secure the connector in place against the boards and ensure electrical connection between the pads on the two boards through the electrical leads of the connector. The alignment frame includes posts to mate with alignment holes in the boards.