Top Port MEMS Cavity Package Base-Mounted Assembly
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Solution Overview
Problem
Existing MEMS device packages face challenges in achieving improved signal-to-noise ratio due to mechanical requirements, particularly in top port configurations, where complex assembly and high costs are incurred when mounting the MEMS device to the cover, which complicates electrical interconnection and alignment.
Innovation Solution
A method for manufacturing a top port MEMS cavity package involves providing a cover with a port, bonding a first base component to the cover's sidewalls, inserting and bonding the MEMS device to overlap the port, and sealing with a second base component, allowing for simplified and cost-effective assembly while maintaining acoustic integrity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If the MEMS device is mounted to the cover in a top port package, then the package meets mechanical requirements, but the assembly process becomes complex and costs increase
Solution Approach 1:
The patent inverts the conventional mounting approach by mounting the MEMS device to the base component instead of the cover. This inversion simplifies the assembly process while still meeting the mechanical requirements for top port packages, as the device can be properly positioned and connected through this alternative mounting configuration
2Reliability
If the MEMS device is mounted to the cover, then electrical interconnection can be established, but alignment precision requirements increase
Solution Approach 1:
The patent inverts the mounting configuration from cover-mounted to base-mounted, which reduces alignment precision requirements. By mounting the MEMS device to the base component, the alignment tolerances are more relaxed compared to cover mounting, while electrical interconnection is still achieved through conductive structures on the base
3Reliability
If a complex assembly process is used to achieve improved signal-to-noise ratio, then acoustic performance improves, but manufacturing cost increases
Solution Approach 1:
The patent inverts the conventional approach by using a base-mounted configuration instead of cover-mounted, which achieves the required acoustic performance and signal-to-noise ratio through a simpler, more cost-effective assembly process. The inverted mounting allows for proper acoustic cavity formation without requiring complex assembly steps
Data Source
AI summary
A method for the manufacture of a package encasing a Micro-Electro-Mechanical Systems (MEMS) device provides a cover having a lid and sidewalls with a port extending through the lid. A first base component is bonded to the sidewalls defining an internal cavity. This first base component further includes an aperture extending therethrough. The MEMS device is inserted through the aperture and bonded to the lid with the MEMS device at least partially overlapping the port. Assembly is completed by bonding a second base component to the first base component to seal the aperture. The package so formed has a cover with a lid, sidewalls and a port extending through the lid. A MEMS device is bonded to the lid and electrically interconnected to electrically conductive features disposed on the first base component. A second base component is bonded to the first base component spanning the aperture.