Top Port MEMS Cavity Package Assembly
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Solution Overview
Problem
Existing MEMS device packages face challenges in achieving improved signal-to-noise ratio and are complex to assemble, especially when mounting the MEMS device to the cover component, which increases costs and complexity.
Innovation Solution
A method for manufacturing a top port package involves a cover with a port, bonding a first base component to the sidewalls, inserting and bonding the MEMS device to the cover, and sealing with a second base component, allowing for simplified assembly and cost-effective production of packages with improved acoustic performance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the MEMS device is mounted to the cover component with circuit traces and conductive sidewalls, then electrical interconnection is achieved, but the package complexity and assembly difficulty increase
Solution Approach 1:
The package is divided into modular components: a base component with integrated circuit traces, a cover component, and a sidewall component. This segmentation allows each component to be manufactured and prepared independently, then assembled together, reducing overall package complexity while maintaining reliable electrical interconnection between the MEMS device and external circuits.
2Adaptability or versatility
If the MEMS device is mounted to the cover component, then mounting flexibility is improved, but assembly precision requirements increase
Solution Approach 1:
The base component is prepared in advance with pre-formed circuit traces and bonding surfaces. The cover component is also pre-prepared with its bonding surfaces. This preliminary preparation of components with their respective features eliminates the need for complex alignment during assembly, as the components are designed to mate together without requiring high precision alignment operations.
3Ease of manufacture
If the package structure is simplified to reduce cost, then manufacturing cost decreases, but acoustic performance may be compromised
Solution Approach 1:
The sidewall component is designed with specific local properties: it includes a port for acoustic signal passage and conductive regions for electrical interconnection. By concentrating the acoustic functionality in the sidewall port region and the electrical functionality in the base component, the design achieves good acoustic performance (signal-to-noise ratio) without requiring complex overall package structures, thus maintaining cost-effectiveness.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method enables robust, cost-effective, and simplified assembly of MEMS device packages with improved acoustic performance by allowing the MEMS device to overlap the port, enhancing signal-to-noise ratio without requiring complex alignment or additional circuit traces on the cover.
Implementation Method 1
Deflection of the diaphragm by acoustic (sound) waves changes the gap spacing creating a measurable change in capacitance
Implementation Method 2
bonding the MEMS device to the lid with the MEMS device at least partially overlapping the port
Data Source
AI summary
A method for the manufacture of a package encasing a Micro-Electro-Mechanical Systems (MEMS) device provides a cover having a lid and sidewalls with a port extending through the lid. A first base component is bonded to the sidewalls defining an internal cavity. This first base component further includes an aperture extending therethrough. The MEMS device is inserted through the aperture and bonded said to the lid with the MEMS device at least partially overlapping the port. Assembly is completed by bonding a second base component to the first base component to seal the aperture. The package so formed has a cover with a lid, sidewalls and a port extending through the lid. A MEMS device is bonded to the lid and electrically interconnected to electrically conductive features disposed on the first base component. A second base component is bonded to the first base component spanning the aperture.