Top Reflector Above Annular Lamp Assembly for Substrate Annealing
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Solution Overview
Problem
The existing semiconductor substrate processing techniques face challenges in achieving uniform heating and efficient throughput due to the need for separate anneal chambers and downtime caused by temperature retention in conventional substrate supports, which hinder the deposition of multiple layers with good film uniformity and low temperature processes.
Innovation Solution
A substrate support pedestal and anneal chamber design that allows for in-situ annealing using a transparent radiation material and a lamp assembly for uniform heating, coupled with a rotation assembly to facilitate rapid temperature changes and reduce downtime, enabling simultaneous processing and annealing within the same chamber.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a conventional substrate support pedestal is used that retains heat when heated to high temperatures, then the substrate can be annealed effectively, but the pedestal must be allowed to cool down before further low temperature processes are conducted, negatively impacting throughput
Solution Approach 1:
The substrate support system is divided into separate functional components: the substrate support pedestal and the lamp assembly. The pedestal can be quickly cooled by lifting it away from the substrate, while the lamp assembly remains in position for rapid reheating when needed. This segmentation allows independent temperature control of the support structure from the substrate.
Solution Approach 2:
The substrate support pedestal is made dynamically movable relative to the substrate and lamp assembly. It can be rapidly positioned close to the substrate for heating and quickly lifted away for cooling, enabling dynamic temperature control without requiring the pedestal itself to retain or dissipate heat slowly.
2Productivity
If the substrate is transferred to a separate anneal chamber to avoid chamber downtime, then in-situ annealing is avoided, but the complexity of the processing system increases and throughput may still be impacted by transfer time
Solution Approach 1:
The deposition chamber is designed to perform multiple functions: both deposition and annealing processes can be conducted in the same chamber. The lamp assembly serves as a universal heating source that can be used for both low-temperature deposition processes and high-temperature annealing, eliminating the need for a separate anneal chamber.
Solution Approach 2:
The annealing function is merged into the deposition chamber by integrating the lamp assembly. This combines what were previously separate functions (deposition and annealing) into a single chamber, eliminating substrate transfer between chambers and reducing system complexity.
3Quantity of substance
If multiple cathodes and targets are disposed off-axis with respect to the substrate to deposit different materials, then material deposition is achieved, but the substrate needs to be rotated to ensure good film uniformity, adding process complexity
Solution Approach 1:
Instead of rotating the substrate to achieve uniform deposition from off-axis cathodes, the approach is inverted: the lamp assembly and heating source are positioned to provide uniform radiant heating from below, and the substrate support is designed to maintain the substrate in a stable position without requiring rotation for uniformity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enhances throughput by allowing for rapid and uniform heating of substrates, reducing downtime and anneal time, and enabling seamless switching between different processing modes without cooling down the substrate support, thus improving the overall efficiency of semiconductor substrate processing.
Implementation Method 1
a lamp assembly disposed below the substrate support pedestal and having a plurality of lamps configured to heat the substrate
Implementation Method 2
the substrate support pedestal is formed of a material that is transparent to radiation
Implementation Method 3
a top reflector disposed above the annular lamp assembly to reflect radiation downwards towards the lamp assembly
Implementation Method 4
a rotation assembly coupled to the shaft opposite the pedestal support to rotate the shaft, the pedestal support, and the substrate support pedestal with respect to the lamp assembly
Data Source
AI summary
Embodiments of a method and apparatus for annealing a substrate are disclosed herein. In some embodiments, a substrate anneal chamber includes a chamber body having a chamber wall and an interior volume; a lamp assembly disposed in the interior volume and having a plurality of lamps configured to heat a substrate; a slit valve disposed through a wall of the chamber body and above the lamp assembly to allow the substrate to pass into and out of the interior volume; an annular lamp assembly having at least one lamp disposed in a processing volume in an upper portion of the substrate anneal chamber above the slit valve; and a top reflector disposed above the annular lamp assembly to define an upper portion of the processing volume and to reflect radiation downwards towards the lamp assembly, wherein a bottom surface of the top reflector is exposed to the interior volume.