Adjustable Top Ring Height for Plasma Sheath Uniformity
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Solution Overview
Problem
Ensuring uniformity in plasma sheath profiles across different wafers or batches during semiconductor processing is crucial for maintaining product quality, but the consumption of top rings due to plasma processes leads to inconsistencies.
Innovation Solution
A lifting mechanism adjusts the height of parts of the top ring in a semiconductor processing apparatus using lift pins or magnetic lifting devices, controlled by a computerized module, to maintain consistent plasma sheath profiles by compensating for thickness loss during plasma processes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If the top ring is used continuously in plasma processes, then productivity is improved, but the top ring thickness is reduced leading to plasma sheath profile inconsistency
Solution Approach 1:
The top ring is designed with a movable portion that can be dynamically adjusted in height along the wafer peripheral region. The lifting mechanism enables the top ring to transition between different vertical positions, allowing compensation for thickness reduction while maintaining plasma sheath profile consistency during continuous processing operations
Solution Approach 2:
The system changes the vertical position parameter of the top ring dynamically. By adjusting the height of the movable portion relative to the fixed portion, the system compensates for the changing thickness of the top ring material, thereby maintaining consistent plasma sheath profiles across multiple processing batches
2Manufacturing precision
If the top ring height is adjusted to compensate for consumption, then plasma sheath profile consistency is improved, but device complexity increases
Solution Approach 1:
The top ring is segmented into a fixed portion and a movable portion that can be independently positioned. This segmentation allows the movable portion to be adjusted for height compensation while the fixed portion remains stationary, simplifying the overall adjustment mechanism compared to moving the entire top ring
Solution Approach 2:
A lifting mechanism acts as an intermediary between the top ring and the processing chamber wall. This intermediary component provides the necessary height adjustment functionality while isolating the complexity of the adjustment system from both the top ring structure and the chamber wall, making the system easier to maintain and control
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach ensures consistent plasma sheath profiles across wafers or batches, minimizing inconsistencies and enhancing device performance uniformity.
Implementation Method 1
a lifting mechanism adjacent to the top ring and configured to lift a part of the top ring
Data Source
AI summary
A semiconductor processing apparatus includes a wafer holder, a top ring surrounding the wafer holder when viewed from top, a lifting mechanism adjacent to the top ring, a monitor module, and a computerized module. The lifting mechanism is configured to lift a part of the top ring. The monitor module is disposed to monitor a current height position of the part of the top ring. The computerized module is electrically connected to the lifting mechanism and the monitor module, and is configured to control the lifting mechanism to lift the part of the top ring from the current height position to a desired height position.