Top-Side Bridge Packaging for Faster Chip-to-Chip Signal Paths
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Solution Overview
Problem
Existing packages with integrated devices face challenges in achieving fast and reliable electrical signal transmission between integrated devices, which affects their performance and signal integrity.
Innovation Solution
Incorporating bridges that provide additional electrical paths between integrated devices, both within the substrate and on top of the devices, to enhance signal transmission and reduce interference.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Speed
If electrical signals travel between integrated devices through the substrate, then the package structure is simple, but the signal transmission speed is slow and signal integrity deteriorates
Solution Approach 1:
The patent introduces bridges that extend vertically above the substrate plane, creating three-dimensional electrical paths. These bridges rise from the substrate and connect to top portions of integrated devices, adding a vertical dimension to signal transmission routes and enabling shorter, faster signal paths that bypass substrate limitations.
Solution Approach 2:
The patent divides the electrical connection path into multiple segments: substrate-level connections, vertical bridge structures, and top-portion connections. This segmentation allows different parts of the connection path to be optimized independently, with bridges providing high-speed direct paths while the substrate handles power and ground distribution.
2Reliability
If multiple solder interconnects are used for signal transmission, then the electrical connections are established, but the power distribution network performance deteriorates due to interference
Solution Approach 1:
The patent extracts signal transmission functions from the substrate plane by introducing separate bridge structures. These bridges carry signal connections above the substrate, freeing up substrate solder interconnects to be dedicated exclusively to power and ground connections, thereby eliminating interference between signal and power paths.
Solution Approach 2:
The bridges act as intermediary structures that mediate between the substrate and the top portions of integrated devices. They provide a dedicated pathway for signal transmission that is physically separated from the power distribution network on the substrate, preventing electromagnetic interference while maintaining electrical connectivity.
Data Source
AI summary
A package comprising a substrate, a first integrated device coupled to the substrate, a second integrated device coupled to the substrate, a first bridge and a second bridge. The first bridge is coupled to the first integrated device and the second integrated device. The first bridge is configured to provide at least one first electrical path between the first integrated device and the second integrated device. The first bridge is coupled to a top portion of the first integrated device and a top portion of the second integrated device. The second bridge is coupled to the first integrated device and the second integrated device. The second bridge is configured to provide at least one second electrical path between the first integrated device and the second integrated device.