Top-Side Memory IC Package Layout for High I/O Density
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Solution Overview
Problem
The increasing number of input/output connections on IC chips necessitates larger IC package sizes and higher costs due to the practical upper limit on solder ball density in ball grid array (BGA) packages, which complicates the printed circuit board (PCB) design and increases manufacturing costs.
Innovation Solution
The implementation of a PCB system with an integrated circuit package that has contact structures on both the top and bottom surfaces, where the memory module is positioned on top of the IC package, using an interposer to electrically couple the contact structures and a heat dissipation member to manage heat, reducing the number of bottom surface connections and overall package size.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If the number of I/O connections on IC chips is increased, then the functionality and performance of the IC chip is improved, but the size and cost of the IC package increases due to the upper limit on solder ball density in BGA packages
Solution Approach 1:
The patent transitions from a two-dimensional BGA arrangement (solder balls on the bottom surface only) to a three-dimensional configuration by adding contact structures on the top surface of the package substrate. This vertical expansion of the connection interface allows additional I/O connections without increasing the lateral footprint of the package, effectively resolving the contradiction between connection density and package size.
Solution Approach 2:
The patent divides the contact structures into two distinct groups: first contact structures on the bottom surface (BGA-style) and second contact structures on the top surface. This segmentation allows each surface to be optimized independently for its specific function, enabling high I/O connectivity without requiring a proportional increase in package area.
2Quantity of substance
If the number of solder balls is increased to accommodate more I/O connections, then the connectivity is improved, but the overall size of the BGA package must be increased
Solution Approach 1:
Instead of increasing the area of the BGA package to accommodate more solder balls, the patent adds a second layer of contact structures on the top surface of the package substrate. This vertical stacking of connection interfaces doubles the available connection area without increasing the lateral dimensions of the package.
3Adaptability or versatility
If the IC package size is increased to accommodate more contact structures, then the number of I/O connections is improved, but the cost of the BGA package increases
Solution Approach 1:
The patent achieves higher I/O connectivity without increasing package size by utilizing the vertical dimension through top-surface contact structures. This approach avoids the cost penalties associated with larger packages while maintaining manufacturing feasibility through standard PCB fabrication techniques.
4Speed
If memory ICs are placed closer to the IC chip, then the performance is improved through faster data access, but heat dissipation becomes more challenging
Solution Approach 1:
The patent introduces a heat dissipation member as an intermediary component positioned between the IC chip and the memory ICs. This heat sink structure actively manages thermal energy by conducting heat away from the IC chip and dissipating it to the surrounding environment, enabling close placement of memory ICs without compromising thermal reliability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration reduces the size and cost of the IC package, simplifies the PCB design, and improves performance by locating memory ICs closer to the IC chip, while maintaining efficient electrical connections and heat dissipation.
Implementation Method 1
a heat dissipation member coupled to the main IC chip... while the heat dissipation member dissipates heat from the main IC chip away from the one or more memory IC chips
Data Source
AI summary
A printed circuit board (PCB) system includes an integrated circuit (IC) package having a main IC chip that is electrically coupled to a top surface of a package substrate. A first printed circuit board (PCB) is electrically coupled to first contact structures on a bottom surface of the package substrate. A heat dissipation member is coupled to the main IC chip. A memory module is configured to electrically couple, via an interposer, with second contact structures on a top surface of the package substrate while the heat dissipation member dissipates heat from the main IC chip away from one or more memory IC chips on the memory module. The interposer is configured to electrically couple the second contact structures of the IC package with the memory module while the heat dissipation member dissipates heat from the main IC chip away from the one or more memory IC chips.