TOPCon Solar Cell Emitter Patterning with Doped Dielectric Protection
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Solution Overview
Problem
The laser irradiation process used to pattern localized emitters in tunnel oxide passivated contact (TOPCON) solar cells causes physical damage to the surface of the base, affecting the performance of the solar cell.
Innovation Solution
A method involving the concurrent formation of doped layers on the substrate, followed by localized laser irradiation and selective etching to pattern the doped layers, which includes using a doped dielectric layer to protect the substrate during laser irradiation and reduce the need for additional masking steps.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If laser irradiation is used to pattern the initial emitter, then the localized emitter can be formed, but physical damage is caused to the surface of the base
Solution Approach 1:
A doped dielectric layer is introduced as an intermediary protective layer between the laser irradiation and the base substrate. This layer absorbs the laser energy and serves as a sacrificial mask, preventing direct damage to the base surface while still enabling precise emitter patterning through controlled etching processes.
Solution Approach 2:
The doped dielectric layer is formed on the base surface before performing the laser irradiation and etching processes. This preliminary formation of the protective layer ensures that the base surface is already shielded against potential damage before the harmful laser irradiation occurs.
2Ease of manufacture
If conventional emitter patterning methods are used, then the manufacturing process is simple, but additional masking steps are required
Solution Approach 1:
The doped dielectric layer serves multiple functions simultaneously: it acts as a protective layer against laser damage, serves as a mask during etching processes, and defines the emitter pattern. This multi-functionality eliminates the need for separate masking steps and simplifies the overall manufacturing process.
Solution Approach 2:
The protective function and masking function are merged into a single doped dielectric layer structure. By combining these two functions into one element, the manufacturing process requires fewer steps and fewer materials, reducing both complexity and cost.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Reduces damage to the substrate during the patterning process, simplifies the manufacturing process, and lowers costs by eliminating the need for additional masking operations while maintaining the integrity of the solar cell components.
Implementation Method 1
localized laser irradiation
Implementation Method 2
using a doped dielectric layer to protect the substrate during laser irradiation
Implementation Method 3
etching away the portions of the target doped dielectric layer over the respective first regions
Data Source
AI summary
Provided is a method for manufacturing a solar cell, including: providing a substrate having a first surface and a second surface opposite to each other forming a first doped layer on the second surface and concurrently forming a second doped layer on a target doped dielectric layer; patterning the second doped layer, including removing portions of the second doped layer; etching away the portion of the target doped dielectric layer over the first region; etching away a portion of the target doped semiconductor layer over the first region, and etching away a portion of the second doped layer over the second region; and etching away the portion of the target doped dielectric layer over the second region, a portion of the target doped semiconductor layer over the second region being reserved as a doped semiconductor portion. The respective first regions and the respective second regions are alternatingly distributed.


