Tophat Enclosed Cavity Structure for Isolated MEMS Integration
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Solution Overview
Problem
There is a need for improved structures that can be readily integrated into electronic and micro-electro-mechanical systems (MEMS) with enhanced performance, particularly in terms of mechanical isolation and integration of components within enclosed cavities.
Innovation Solution
The development of enclosed cavity structures on substrates, where components such as MEMS devices are housed within cavities formed in the substrate, and covered with caps that adhere to the substrate or destination substrate, allowing for mechanical isolation and improved integration.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If components are assembled on the substrate using individually packaged surface-mount integrated-circuit devices, then device performance is improved, but device size and integration density increase
Solution Approach 1:
The patent extracts components from the substrate plane by creating enclosed cavities that house components in three-dimensional space. Components are placed inside cavities formed in the substrate, removing them from the two-dimensional surface assembly and enabling vertical integration while maintaining performance.
Solution Approach 2:
The invention transitions from two-dimensional surface mounting to three-dimensional cavity-based assembly. By utilizing the vertical dimension and creating enclosed volumes within the substrate, the patent enables component placement in the Z-direction, significantly increasing integration density without compromising device performance.
2Area of stationary object
If thin-film circuits are used to reduce device size, then integration density is improved, but manufacturing complexity increases
Solution Approach 1:
The patent segments the manufacturing process into distinct stages: cavity formation in the substrate, component placement within cavities, and cap assembly. This segmentation allows each stage to be optimized independently, reducing overall manufacturing complexity while achieving high integration density through systematic organization of manufacturing steps.
3Device complexity
If components are placed directly on the substrate, then device complexity is reduced, but mechanical isolation and stiction issues worsen
Solution Approach 1:
The patent implements a nested structure where components are placed inside enclosed cavities within the substrate, and caps are positioned over the cavities to seal them. This nesting provides mechanical isolation and prevents stiction by creating a controlled environment within the cavity, while maintaining relatively simple overall device architecture.
Solution Approach 2:
The cavity acts as an intermediary structure between the substrate and the component. This intermediate enclosed space provides mechanical isolation, prevents direct contact between components and the substrate exterior, and eliminates stiction issues by controlling the component environment without requiring complex isolation mechanisms.
Data Source
AI summary
An example of a cavity structure comprises a cavity substrate comprising a substrate surface, a cavity extending into the cavity substrate, the cavity having a cavity bottom and cavity walls, and a cap disposed on a side of the cavity opposite the cavity bottom. The cavity substrate, the cap, and the one or more cavity walls form a cavity enclosing a volume. A component can be disposed in the cavity and can extend above the substrate surface. The component can be a piezoelectric or a MEMS device. The cap can have a tophat configuration. The cavity structure can be micro-transfer printed from a source wafer to a destination substrate.