Toroid Inductor in Redistribution Layers for Integrated Devices
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Solution Overview
Problem
In traditional electronic designs, placing an inductor outside the package can lead to electromagnetic interference with the die, and integrating it within the die increases the Si die area, making it desirable to have a toroid inductor closer to the die while minimizing interference.
Innovation Solution
A toroid inductor is integrated into the redistribution layers of an integrated device, comprising multiple metal and dielectric layers, with the inductor's windings configured within the redistribution layers to minimize space and interference, allowing for closer proximity to the die without increasing the die area.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If an inductor is placed outside the package, then electromagnetic interference with the die is reduced, but the inductor is far away from the die
Solution Approach 1:
The patent combines the inductor with the package structure by integrating it into the redistribution layers, merging two previously separate components (inductor and package) into a single integrated structure, thereby reducing distance while managing electromagnetic interference
2Length of moving object
If an inductor is integrated within the die, then the inductor is close to the die, but the Si die area increases
Solution Approach 1:
The patent moves the inductor from the traditional planar die surface to the vertical redistribution layers, utilizing the third dimension (height/depth) to accommodate the inductor structure, thereby achieving close proximity without increasing the horizontal die area
3Length of moving object
If an inductor is integrated within the die, then the inductor is close to the die, but electromagnetic interference with active elements increases
Solution Approach 1:
The patent extracts the inductor from the traditional die structure and relocates it to the redistribution layers, separating the inductor function from the active circuit elements while maintaining close proximity, thereby reducing electromagnetic interference with sensitive components
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enables a compact and efficient integration of the toroid inductor within the die, reducing electromagnetic interference and optimizing space usage, thus addressing the need for a closer inductor placement while maintaining die area efficiency.
Implementation Method 1
The first and second metal redistribution layers are configured to operate as a toroid inductor in the integrated device
Data Source
AI summary
Some features pertain to an integrated device that includes a substrate, several metal layers coupled to the substrate, several dielectric layers coupled to the substrate, a first metal redistribution layer coupled to one of the metal layers, and a second metal redistribution layer coupled to the first metal redistribution layer. The first and second metal redistribution layers are configured to operate as a toroid inductor in the integrated device. In some implementations, the integrated device also includes a third metal redistribution layer. The third metal redistribution layer is coupled to the first and second metal redistribution layers. The third metal redistribution layer is a via. In some implementations, the first, second, and third metal redistribution layers are configured to operate as a toroid inductor in the integrated device. In some implementations, the first, second, and third redistribution layers form a set of windings for the toroid inductor.