Toroidal Coil Module with Metal Pins and Buffer Layer
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Solution Overview
Problem
The challenge is to reduce the size of modules containing toroidal coils while maintaining high inductance, as conventional through-hole conductors and via conductors have limitations in pitch, gap, and diameter, and direct contact between metal pins and the coil core can worsen coil characteristics due to thermal expansion differences.
Innovation Solution
A module configuration with an insulating layer, a coil core, and a coil electrode using metal pins with a buffer layer made of non-conductive material to prevent direct contact and thermal stress, allowing for closer pin placement and reduced cross-sectional areas, thereby increasing the number of turns and inductance without the need for laser-formed holes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If through-hole conductors or via conductors are used to connect upper and lower wiring electrode patterns, then the coil can be contained within the wiring board, but the pitch, gap, and diameter are limited which restricts the number of turns and inductance
Solution Approach 1:
The patent introduces metal pins as an intermediary component that connects the upper and lower wiring electrode patterns without requiring holes through the wiring board. This intermediary solution eliminates the pitch and gap limitations imposed by laser-formed holes or via conductors, allowing for closer spacing and higher number of turns in the coil electrode.
2Productivity
If metal pins are used instead of through-hole conductors, then the pitch and cross-sectional area can be reduced, but direct contact with the coil core may worsen coil characteristics due to thermal expansion differences
Solution Approach 1:
The patent introduces an insulating layer as an intermediary between the metal pins and the coil core. This insulating layer prevents direct contact, thereby eliminating the thermal expansion compatibility issues that would otherwise worsen coil characteristics, while still allowing the metal pins to provide low-resistance electrical connections with reduced pitch and cross-sectional area.
Solution Approach 2:
The patent applies different material properties to different parts of the connection system: metal pins provide low-resistance electrical conduction, the insulating layer provides thermal expansion isolation, and the wiring board provides mechanical support. This local differentiation of material qualities allows each component to optimize its function without compromising overall reliability.
3Quantity of substance
If the number of turns is increased to achieve higher inductance, then the coil fits within limited space, but the pitch between conductors and their diameters must be reduced which is limited by manufacturing capabilities
Solution Approach 1:
The patent uses metal pins as intermediaries that eliminate the need for narrow pitch holes, and uses an insulating layer as an intermediary that allows the coil core to be positioned close to the metal pins without direct contact. This enables increased number of turns and higher inductance while maintaining manufacturable dimensions for all components.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances coil characteristics by increasing inductance, reducing manufacturing costs, and mitigating thermal stress, while maintaining lower resistance values and avoiding the need for insulative coatings on metal pins.
Implementation Method 1
disposing the metal pins and the coil core 102 in contact with each other can also worsen the characteristics of the coil. Although covering the peripheral surfaces of the metal pins with an insulative film can be considered in this case
Implementation Method 2
a buffer layer, formed from a non-conductive material having a lower elastic modulus than the insulating layer, that is provided covering a surface of the coil core so as to be interposed between each of the one-side metal pins and the coil core and/or between each of the other-side metal pins and the coil core
Data Source
AI summary
A module includes: an insulating layer; an annular coil core in the insulating layer; a coil electrode having outer metal pins arranged along an outer circumferential surface of the coil core, inner metal pins arranged along an inner circumferential surface of the coil core to form pairs with corresponding outer metal pins 7, bonding wires, each connecting one end surface of each outer metal pin and inner metal pin that form a pair, and wiring electrode patterns, each connecting another end surface of each outer metal pin to another end surface of an inner metal pin adjacent in a predetermined direction to the inner metal pin that forms a pair with the outer metal pin; and a buffer layer, formed from a non-conductive material having a lower elastic modulus than the insulating layer, that covers the surface of the coil core.