Toroidal PCB-Embedded Air-Core Inductors for High-Frequency Inverters
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Solution Overview
Problem
High-frequency power inverters require smaller inductance values and efficient filtering circuits to minimize size, cost, and electromagnetic interference, while maintaining high reliability and efficiency, which existing inductor configurations struggle to achieve.
Innovation Solution
The development of toroidal PCB-embedded air-core inductors with a dual-plane arrangement of metal layers and through-substrate vias, optimized for high-frequency switching operations, providing improved efficiency, reduced size, and enhanced thermal conduction.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If conventional air-core inductors are used in high-frequency power inverters, then electromagnetic interference is reduced and efficiency is improved, but the inductor size and complexity increase
Solution Approach 1:
The patent combines multiple inductor windings into a single integrated PCB structure, merging what would traditionally be separate inductor components into one unified embedded structure. This reduces the number of discrete components while maintaining the efficiency benefits of air-core inductors at high frequencies.
Solution Approach 2:
The patent transitions from traditional three-dimensional wire-wound inductors to a two-dimensional PCB-plane implementation. By laying out the inductor windings on the PCB surface and using vias to create vertical connections, the design achieves compact integration while maintaining the electrical characteristics of air-core inductors.
2Volume of moving object
If inductor size is reduced for miniaturization, then integration with power electronic circuitry is improved, but electromagnetic interference increases
Solution Approach 1:
The patent uses PCB planes and vias to create compact inductor structures that fit within the board footprint. The toroidal configuration achieved through via connections provides magnetic field containment, reducing EMI while maintaining miniaturization benefits.
Solution Approach 2:
The patent implements a toroidal (doughnut-shaped) inductor configuration using PCB traces and vias. This curved, closed-loop structure naturally contains magnetic fields within the toroid, significantly reducing electromagnetic interference compared to straight or spiral configurations, while maintaining a compact footprint.
3Device complexity
If PCB embedded inductors are used for integration, then miniaturization is achieved, but manufacturing precision requirements increase
Solution Approach 1:
The patent uses generous trace clearances and via diameters that exceed minimum PCB fabrication capabilities. By designing with larger dimensions than absolutely required, the design accommodates standard PCB manufacturing tolerances and reduces the need for high-precision fabrication processes.
Solution Approach 2:
The patent optimizes geometric parameters such as trace width, trace spacing, and via diameter to achieve the desired inductance values while maintaining manufacturability. By carefully selecting these parameters within standard PCB fabrication ranges, the design achieves both integration benefits and manufacturing feasibility.
4Power
If high-frequency switching operation is implemented, then power density is increased, but thermal management challenges increase
Solution Approach 1:
The patent combines the inductor function with the PCB thermal management system. The PCB ground planes and copper layers that provide electrical connectivity also serve as heat sinks and thermal conduction paths, efficiently conducting heat away from high-power switching devices to the PCB edges where it can be dissipated.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The toroidal PCB-embedded air-core inductors achieve high efficiency (>98%) and reliability at reduced costs, with reduced size and improved thermal management, suitable for high-frequency power inverter applications.
Implementation Method 1
toroidal PCB-embedded air-core inductors... configured to provide high frequency switching operation of power inverter devices
Implementation Method 2
improved efficiency, reduced size, better thermal conduction
Data Source
AI summary
Devices, systems, and methods of manufacture relating to PCB embedded inductors are described in the present disclosure. Namely, an example device includes a substrate having an upper surface and an opposing lower surface. The device also includes a plurality of upper conductors disposed along the upper surface and a plurality of lower conductors disposed along the lower surface. The upper conductors and the lower conductors are radially disposed about a central axis. Each of the upper conductors and the lower conductors includes a petal shape. A distance between adjacent upper conductors is less than a width of each upper conductor and a distance between adjacent lower conductors is less than a width of each lower conductor. The device also includes a plurality of through-substrate conductors connecting respective upper conductors to respective lower conductors so as to form a series electrical connection. The series electrical connection includes a toroid configuration.