Torsional Shear Testing Semiconductor Surface Bonds
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Solution Overview
Problem
Existing methods for testing the bond strength of semiconductor surface bonds, such as shear testing and pull testing, often apply force non-uniformly or not in the same plane as the bond face, leading to inaccurate measurements of bond strength.
Innovation Solution
The use of a torsional shear tool that centers and clamps a semiconductor die or wafer portion with a surface bond, applies a torsional load, and measures the torque value associated with the load, ensuring that the testing force is applied in-plane to the surface bond.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If existing shear testing or pull testing methods are used, then bond strength testing can be performed, but the force is applied non-uniformly or not in the same plane as the bond face, leading to inaccurate measurements
Solution Approach 1:
The testing system is segmented into distinct functional components: a clamping mechanism that secures the substrate, a torsional loading mechanism that applies controlled rotational force, and a measurement system that records torque values. This segmentation allows each component to be optimized for its specific function while working together to achieve accurate in-plane bond strength measurements.
Solution Approach 2:
The invention transitions from conventional linear shear or pull testing to torsional testing, introducing a rotational dimension to the force application. By applying torque around an axis perpendicular to the bond face, the system ensures force is applied uniformly in the plane of the bond, eliminating the measurement inaccuracies associated with non-uniform force application in traditional methods.
2Reliability
If conventional shear or pull testing is used, then bond strength can be evaluated, but the force application is not uniform and not in the same plane as the bond face
Solution Approach 1:
The invention introduces a torsional shear tool as an intermediary device between the testing apparatus and the bonded substrate. This tool features a clamping mechanism that secures the substrate and a torque application mechanism that translates rotational force into uniform in-plane loading on the bond interface, ensuring reliable measurement while managing device complexity through functional integration.
Solution Approach 2:
The invention changes the fundamental loading parameter from linear force (shear or tensile) to rotational torque. By applying torque around an axis perpendicular to the bond face, the system achieves uniform force distribution across the bond interface in the same plane as the bond, significantly improving evaluation reliability. The torque parameter is directly measurable and correlates to bond strength.
3Measurement precision
If torsional shear testing is implemented, then accurate in-plane bond strength measurement is achieved, but the device complexity increases
Solution Approach 1:
The torsional shear tool is designed with multi-functional capabilities: it can clamp substrates of different sizes, apply controlled torque, measure rotational force, and evaluate bond strength. By integrating these functions into a single device, the system achieves high measurement precision while minimizing the need for multiple separate testing equipment, thereby managing overall device complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method provides an accurate and reliable measurement of bond strength by applying a torsional load in the same plane as the bond face, allowing for precise determination of bond energy and fatigue strength.
Implementation Method 1
applying a torsional load to the first die with respect to the wafer using the torsional shear tool, and measuring a torque value associated with the torsional load
Data Source
AI summary
A method of testing semiconductor surface bonds includes centering a torsional shear tool with respect to a first die having a surface bond to a wafer, clamping the first die using the torsional shear tool, applying a torsional load to the first die with respect to the wafer using the torsional shear tool, and measuring a torque value associated with the torsional load.