Tortuous Solid-Wall Thermal Stand-Off for Isolation
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Solution Overview
Problem
The use of high thermal resistance materials in components exposed to elevated temperatures adds cost and complexity, and ancillary components experience similar temperatures through thermal conduction, requiring effective thermal management without direct exposure.
Innovation Solution
A thermal stand-off with a tortuous solid-wall thermal conduction path that is longer than the spatial region by a factor of at least two, potentially incorporating open space, low-vacuum space, or phase change materials, and having a tensile spring constant greater than a coil spring of the same material composition, to enhance thermal isolation and structural support.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If high thermal resistance materials are used in components exposed to elevated temperatures, then thermal protection is improved, but cost and design complexity increase
Solution Approach 1:
The connector is divided into distinct thermal zones: a hot-end portion exposed to elevated temperatures and a cold-end portion at ambient temperature, separated by a thermal barrier section. This segmentation allows each section to be optimized for its specific thermal environment, using standard materials in the cold end while providing thermal protection only where needed.
Solution Approach 2:
A thermal barrier section acts as an intermediary between the hot-end and cold-end portions of the connector. This intermediate structure provides thermal isolation through its geometry (reduced cross-sectional area and/or increased length) without requiring expensive thermal resistance materials throughout the entire connector, thereby reducing overall cost and complexity.
2Reliability
If high thermal resistance materials are used to protect ancillary components from thermal conduction, then component temperature exposure is reduced, but cost increases
Solution Approach 1:
The thermal barrier property is applied locally only to the thermal barrier section where thermal isolation is needed, rather than using high thermal resistance materials throughout the entire connector. The hot-end and cold-end portions can use standard, lower-cost materials since they are either exposed to heat or already protected by the localized thermal barrier.
Solution Approach 2:
The thermal barrier section changes geometric parameters (reduced cross-sectional area and/or increased length) to achieve thermal resistance without changing material composition to expensive thermal resistance materials. This geometric modification provides the necessary thermal protection at lower material cost.
3Reliability
If a thermal stand-off with a tortuous thermal conduction path is used, then thermal isolation is improved, but structural rigidity may be compromised
Solution Approach 1:
The thermal barrier section extends in the axial dimension (increased length) and reduces cross-sectional dimensions to create a tortuous thermal conduction path. This dimensional change increases thermal resistance by lengthening the heat path while the overall connector structure maintains rigidity through its external geometry and connection interfaces.
Solution Approach 2:
The connector is segmented into a rigid hot-end portion, a thermal barrier section with optimized geometry for thermal isolation, and a cold-end portion. This segmentation allows the thermal barrier to focus on thermal isolation while the other sections maintain structural rigidity for mechanical support.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides effective thermal isolation and structural support, reducing thermal conduction and extending the life of temperature-sensitive components while maintaining structural integrity and reducing material costs.
Implementation Method 1
a tortuous solid-wall thermal conduction path provided by solid walls extending in a circuitous path between the first location and the second location
Implementation Method 2
the rigid thermal stand-off section includes a phase change material between sections of the tortuous solid-wall thermal conduction path
Implementation Method 3
the rigid thermal stand-off section includes low-vacuum space between sections of the tortuous solid-wall thermal conduction path
Data Source
Figure 1~3
AI summary
A thermal stand-off (22;122) includes a thermal stand-off section (28;128) within a spatial region (S) that extends along a distance between a first location (A) and second, opposed location (B). The rigid thermal stand-off section (28;128) includes a tortuous solid-wall thermal conduction path (30;130) that extends from the first location (A) to the second location (B). The tortuous solid-wall thermal conduction path (30;130) is longer than the distance of the spatial region (S). The tortuous solid-wall thermal conduction path (30;130) can include a tensile spring constant that is greater than a maximum tensile spring constant of a coil spring that fits in the same spatial region (S) and is formed of the same material composition. The tortuous solid-wall thermal conduction path (30;130) can include an antegrade section (136) and, relative the antegrade section (136), a retrograde section (138).