Touch Flex Circuit Support Structure to Prevent Display Warping

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Solution Overview

Problem

Flexible circuit boards in display devices tend to warp, leading to potential damage and communication failures due to bending stress, especially at regions without structural support, such as near openings in the touch flexible circuit board.

Innovation Solution

Incorporating a ring structure with an accommodating space between the touch flexible circuit board and the display substrate, which houses the driver, eliminating the need for openings in the touch flexible circuit board and enhancing structural strength to prevent warping, while also allowing for efficient heat dissipation using a connection layer, buffer layer, and heat transfer layer.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of manufacture

If openings are provided in the touch flexible circuit board to accommodate the driver, then the driver can be mounted, but the flexible circuit board becomes prone to warping and bending stress damage

Engineering Contradiction:
Improvedriver mountingVSAvoidcircuit board warping resistance
Core Design Contradiction:
Ease of manufactureVSReliability

Solution Approach 1:

A support structure comprising a first support portion and a second support portion is introduced as an intermediary element. The first support portion is positioned at the opening of the flexible circuit board to prevent warping, while the second support portion supports the driver chip. This intermediary structure enables both driver mounting and warping prevention without requiring the circuit board material itself to bear the mechanical stress.

Inventive Principle:
Principle #24Intermediary (Mediator)

Solution Approach 2:

The support structure is segmented into distinct functional portions: a first support portion dedicated to preventing circuit board warping at the opening, and a second support portion dedicated to supporting the driver chip. This segmentation allows each portion to be optimized for its specific function, with the first portion providing structural reinforcement and the second portion providing component support.

Inventive Principle:
Principle #1Segmentation

2Strength

If the touch flexible circuit board is made without openings, then structural strength is enhanced, but the driver cannot be mounted directly

Engineering Contradiction:
Improvecircuit board structural strengthVSAvoiddriver mounting
Core Design Contradiction:
StrengthVSEase of manufacture

Solution Approach 1:

The support structure serves as an intermediary platform that bridges the gap between the intact flexible circuit board and the driver chip. By providing a dedicated mounting platform on the support structure, the driver can be mounted without creating openings in the circuit board, thus maintaining structural strength while enabling component integration.

Inventive Principle:
Principle #24Intermediary (Mediator)

3Shape

If the flexible circuit board is bent freely to reduce bezel width, then screen-to-body ratio increases, but the circuit board becomes susceptible to damage from bending stress

Engineering Contradiction:
Improvescreen-to-body ratioVSAvoidcircuit board durability under bending
Core Design Contradiction:
ShapeVSReliability

Solution Approach 1:

The support structure provides beforehand cushioning by positioning the first support portion at the opening and the second support portion under the driver chip. This preemptive support system cushions the flexible circuit board against bending stresses that occur during device flexing, preventing damage while allowing the desired screen-to-body ratio to be achieved through flexible positioning.

Inventive Principle:
Principle #11Beforehand cushioning (Prior cushioning)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution effectively prevents warping of the flexible circuit board, reduces the risk of driver and circuit board contact, and enhances manufacturing efficiency by eliminating the opening process, thereby improving the reliability and durability of the display device.

Implementation Method 1

the heat transfer layer comprises a metal layer

Methodology Applied
Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 2

the buffer layer comprises an elastic material layer

Methodology Applied
Scientific EffectElasticity: Elasticity

Data Source

PatentUS11997794B2Display device
Publication Date: 2024.05.28 CHENGDU BOE OPTOELECTRONICS TECH CO LTD
  • US11997794B2 patent drawing
  • US11997794B2 patent drawing
  • US11997794B2 patent drawing

AI summary

A display device is provided. The display device includes: a display substrate having a non-display side, a first driver being provided at the non-display side of the display substrate; a touch module comprising a touch layer and a touch flexible circuit board connected with the touch layer, the touch flexible circuit board comprising a flat portion located at a side of the second portion away from the first portion and a second bent portion for connecting the touch layer and the flat portion; and a supporting wall between the flat portion of the touch flexible circuit board and the second portion of the display substrate, and the supporting wall is located on at least one side of the first driver in a direction parallel to the flat portion of the touch flexible circuit board.