Touch Device Manufacturing with Protective Layer and Edge Strengthening
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The productivity of touch devices is low, and processing costs are increasing, limiting their use in display devices due to their weight and size requirements.
Innovation Solution
A touch device with a substrate surface roughness of less than 1.2 nm, featuring a touch sensor and a flexible printed circuit board, manufactured using a resin composition of 20-50% phenol resin and epoxy acrylate with a protective layer to prevent damage from etchants, and a method involving mechanical or chemical treatment to strengthen the substrate edges.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If traditional manufacturing methods are used for touch devices, then the touch sensors can be produced, but the productivity is low and processing costs are increasing
Solution Approach 1:
The patent divides the manufacturing process into distinct stages: forming protective layers on mother substrates before division, mechanically cutting or chemically treating to divide substrates, and then chemically strengthening edges. This segmentation allows parallel processing and optimization of each stage, improving overall productivity while controlling costs.
Solution Approach 2:
The patent applies preliminary protective coating to mother substrates before division and chemical strengthening. This preliminary action prevents damage during subsequent processing steps, reducing waste and rework, thereby improving productivity and reducing processing costs.
2Strength
If the substrate edge is chemically strengthened to improve durability, then the strength increases, but the surface may be damaged by etchants
Solution Approach 1:
The patent applies a protective layer to the substrate surface before chemical strengthening with etchants. This preliminary protective action prevents etchant damage to the surface while allowing the edges to be chemically strengthened, thus achieving both increased strength and surface protection.
Solution Approach 2:
The protective layer acts as an intermediary between the etchant and the substrate surface. It allows the etchant to strengthen the edges through the protective layer without directly damaging the surface, enabling chemical strengthening while preventing etchant harm.
3Measurement precision
If the surface roughness is reduced to improve touch sensitivity, then the touch detection accuracy improves, but the manufacturing complexity increases
Solution Approach 1:
The patent forms protective layers on mother substrates before division, which helps maintain surface integrity and achieve low surface roughness (<1.2 nm) without requiring complex post-processing. This preliminary surface preparation simplifies the overall manufacturing process while achieving high touch detection accuracy.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Improves productivity and reduces processing costs by enhancing the manufacturing efficiency and sensitivity of touch devices while maintaining a lightweight and slim design.
Implementation Method 1
a resin composition to prevent damage of a surface of a substrate from an etchant when an edge thereof is strengthened
Implementation Method 2
forming a protective layer per a touch sensor on a first and a second surfaces of a mother substrate
Implementation Method 3
chemically strengthening an edge of each of the substrates
Data Source
AI summary
Discussed is a method for manufacturing a touch device, the method including forming a protective layer per touch sensor on first and second surfaces of a mother substrate on which two or more touch sensors are formed; dividing the mother substrate into two or more substrates of a touch sensor unit by mechanically cutting or chemically treating the mother substrate; chemically strengthening an edge of each of the divided substrates; and removing the protective layer from at least one divided substrate.