Touch Display Module Adhesive Frame Bending Reliability

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Solution Overview

Problem

Current touch display modules with 3D touch function have low sensitivity and are prone to peeling and cracking due to the limitations of conductive adhesive layers used in bonding force sensing resistor layers with touch panels, especially in flexible screens.

Innovation Solution

A touch display module design featuring an adhesive frame between the display panel assembly and the touch panel assembly, where the force sensing resistor layer is directly adhered to the touch panel using a peripheral adhesive frame, allowing for improved bending reliability and sensitivity without the need for a conductive adhesive layer between the force sensing resistor layer and the touch region.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If a conductive adhesive layer is used to bond the force sensing resistor layer with the touch panel, then the touch display module can be assembled, but the sensitivity is reduced and the structure is prone to peeling and cracking

Engineering Contradiction:

Improvebending reliabilityVSAvoidtouch sensitivity

Core Design Contradiction:

ReliabilityVSManufacturing precision

Solution Approach 1:

The patent removes the conductive adhesive layer from the bonding structure, replacing it with a direct bonding approach between the force sensing resistor layer and touch panel. This extraction eliminates the source of peeling and cracking while maintaining electrical conductivity through alternative means, thereby improving both reliability and sensitivity.

Inventive Principle:

Principle #2Taking out (Extraction)

Solution Approach 2:

The patent employs composite material structures in the force sensing resistor layer and touch panel assembly, utilizing materials with complementary properties that provide both mechanical strength for bending reliability and electrical conductivity for touch sensitivity, eliminating the need for a separate conductive adhesive layer.

Inventive Principle:

Principle #40Composite materials

2Reliability

If a thin conductive adhesive layer is used for bonding, then the structure can be assembled, but it is prone to peeling and cracking during bending

Engineering Contradiction:

Improveresistance to bendingVSAvoidadhesive layer structure

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

The patent extracts and eliminates the thin conductive adhesive layer from the bonding structure, replacing it with a direct bonding interface between the force sensing resistor layer and touch panel. This simplifies the device structure while dramatically improving resistance to bending and eliminating peeling and cracking issues.

Inventive Principle:

Principle #2Taking out (Extraction)

Solution Approach 2:

The patent utilizes flexible substrate materials and thin film structures that can accommodate bending deformations without cracking, replacing the rigid-thin conductive adhesive layer with a more flexible bonding approach that maintains integrity during flexing.

Inventive Principle:

Principle #30Flexible shells and thin films

3Ease of manufacture

If a conductive adhesive layer is used between the force sensing resistor layer and touch panel, then bonding is achieved, but production cost and complexity increase

Engineering Contradiction:

Improvebonding processVSAvoidadhesive layer requirements

Core Design Contradiction:

Ease of manufactureVSDevice complexity

Solution Approach 1:

The patent removes the conductive adhesive layer from the manufacturing process, eliminating the need for specialized adhesive application and curing steps. This direct bonding approach simplifies the manufacturing process while reducing material costs and production complexity.

Inventive Principle:

Principle #2Taking out (Extraction)

Solution Approach 2:

The patent merges the bonding function and electrical conductivity function into a single direct interface between the force sensing resistor layer and touch panel, eliminating the need for a separate conductive adhesive layer and its associated manufacturing complexities.

Inventive Principle:

Principle #5Merging (Combining)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The design enhances touch sensitivity and bending reliability, reducing production costs and complexity, while being suitable for flexible and foldable devices by eliminating the need for a thin conductive adhesive layer, thus preventing peeling and cracking.

Implementation Method 1

an adhesive frame between the display panel assembly and the touch panel assembly, wherein the adhesive frame is configured to adhere a peripheral region of the display panel assembly to a peripheral region of the touch panel assembly

Methodology Applied

Scientific EffectAdhesive bonding: Adhesive

Data Source

PatentUS11163415B2Touch display module, touch display device and electronic device

Publication Date: 2021.11.02 BEIJING BOE TECH DEV CO LTD

AI summary

A touch display module, a touch display device, and an electronic device are provided. The touch display module includes a display panel assembly and a touch panel assembly opposite to each other, with an adhesive frame disposed between the display panel assembly and the touch panel assembly. The display panel assembly comprises a force sensing resistor layer on a side of the display panel assembly facing the touch panel assembly, and the adhesive frame is configured to adhere a peripheral region of the display panel assembly to a peripheral region of the touch panel assembly.