Touch Display Module Narrow Frame Design via Adhesive Integration
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Solution Overview
Problem
Current touch display modules using side-lit backlight modules face challenges such as increased cost and complexity due to multiple layers of optical adhesives, thickness issues, and the need for a larger frame structure, which hinder the achievement of a narrow frame design and are prone to substrate cracking during bonding.
Innovation Solution
The electronic device incorporates a touch display module with a thin-film transistor substrate and color filter substrate, where the thin-film transistor substrate serves as a fixed structure replacing the conventional glass cover, and the backlight components are directly stacked within the outer housing, eliminating the need for metal and plastic parts, thus reducing thickness and using pressure-sensitive adhesive layers for secure bonding.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If multiple layers of optical adhesive are used for bonding in side-lit backlight modules, then the bonding strength is improved, but the manufacturing complexity and cost increase
Solution Approach 1:
The patent merges multiple bonding functions into a single pressure-sensitive adhesive layer. Instead of using multiple separate adhesive layers for different bonding purposes, one adhesive layer performs multiple bonding functions simultaneously, reducing the number of bonding operations and simplifying the manufacturing process while maintaining adequate bonding strength.
Solution Approach 2:
The pressure-sensitive adhesive layer serves multiple functions: it bonds the touch display module to the outer housing, provides structural support, and eliminates the need for separate metal and plastic frame parts. This multi-functionality reduces both the number of components and the complexity of assembly operations.
2Reliability
If multiple layers of optical adhesive and frame structures are used, then the bonding reliability is improved, but the overall thickness increases
Solution Approach 1:
The patent uses a thin pressure-sensitive adhesive layer instead of multiple thick adhesive layers and rigid frame structures. This thin film approach maintains bonding reliability through the adhesive properties of the pressure-sensitive material while significantly reducing the overall thickness of the backlight module assembly.
Solution Approach 2:
The patent extracts and eliminates unnecessary metal and plastic frame parts from the traditional side-lit backlight module design. By removing these redundant structural components and relying on the thin adhesive layer for bonding, the overall thickness is reduced while maintaining structural integrity.
3Stability of the object's composition
If a larger frame structure is used to fix the backlight module, then the structural stability is improved, but the frame width increases
Solution Approach 1:
The pressure-sensitive adhesive layer serves as both the bonding agent and the structural frame replacement. It performs the dual function of adhering components together while providing the structural stability previously required by separate metal and plastic frame parts, enabling a narrow frame design.
Solution Approach 2:
The patent merges the functions of the frame structure and the adhesive bonding layer into a single integrated solution. The adhesive layer simultaneously provides structural support and bonding, eliminating the need for separate wide frame structures and achieving narrow frame dimensions.
4Strength
If conventional glass cover and metal parts are used in backlight modules, then the structural strength is improved, but the overall thickness and weight increase
Solution Approach 1:
The patent replaces conventional thick glass covers and metal parts with a thin pressure-sensitive adhesive layer that provides sufficient structural strength for the application. This thin film approach maintains the necessary structural integrity while dramatically reducing the overall thickness and weight of the backlight module.
Solution Approach 2:
The patent uses a pressure-sensitive adhesive layer that can be easily applied and removed without damaging other components, replacing permanent metal fasteners and rigid glass covers. This approach simplifies assembly and disassembly while reducing thickness, though it may require more careful handling during use.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration reduces the overall thickness of the electronic device, enables a narrower frame design, and addresses the issues of substrate cracking and complexity in bonding, while maintaining effective light distribution for display functionality.
Implementation Method 1
The electronic device further includes a pressure-sensitive adhesive layer. The pressure-sensitive adhesive layer is disposed between and contacts the extension portion and the engaging portion.
Data Source
AI summary
An electronic device includes an outer housing, a touch display module, and at least one optical assembly. The outer housing has an accommodating portion and an engaging portion. The touch display module is disposed in the accommodating portion and engaged with the engaging portion. The touch display module includes a thin-film transistor substrate, a color filter substrate, and a touch electrode layer. The color filter substrate is disposed on a side of the thin-film transistor substrate facing the outer housing. The touch electrode layer is disposed between the thin-film transistor substrate and the color filter substrate. The optical assembly is disposed on a side of the color filter substrate away from the thin-film transistor substrate.