Touch Display Fan-Out Structure for Narrow Border Area
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Solution Overview
Problem
In-cell touch displays face challenges in reducing border area and design complexity due to the need for outer lead bonding regions on different sides of substrates, which increases the electronic device's thickness and restricts component arrangement.
Innovation Solution
The touch display apparatus features a fan-out design with convex and concave parts on the substrates, allowing outer lead bonding regions to be exposed and integrated on the same side, reducing border area and enhancing component connectivity without altering the manufacturing process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the outer lead bonding regions of the upper substrate and lower substrate are arranged on different sides to avoid shielding, then electrical connectivity is achieved, but the border area significantly increases
Solution Approach 1:
The patent applies dimensionality change by moving the outer lead bonding regions from opposite sides (3D spatial separation) to the same side (2D planar arrangement) through fan-out structure. The convex and concave parts create localized 3D relief features that enable same-side bonding while preventing substrate shielding, thus reducing border area while maintaining electrical connectivity
Solution Approach 2:
The patent implements nesting by placing the outer lead bonding regions within the same planar boundary on one side of the display device. The convex part of one substrate nests within the projection area of the other substrate, allowing both bonding regions to coexist on the same side without mutual shielding, thereby reducing the overall border area
2Length of stationary object
If the touch component is built in the display device to reduce thickness, then the touch display becomes slimmer, but the wiring arrangement and component layout become more restricted
Solution Approach 1:
The patent segments the substrate structure into distinct convex and concave regions, allowing independent optimization of different functional areas. The convex part accommodates one outer lead bonding region while the concave part accommodates the other, enabling simplified wiring arrangement on the same side without increasing thickness
Solution Approach 2:
The patent uses 3D surface modulation (convex and concave parts) to resolve the 2D wiring layout problem. By creating vertical relief features on the substrate surface, the patent enables same-side bonding regions without requiring complex through-substrate wiring, thus reducing wiring arrangement complexity while maintaining slim profile
3Area of stationary object
If convex and concave parts are added to substrates to enable same-side outer lead bonding, then border area is reduced, but substrate structure becomes more complex
Solution Approach 1:
The patent applies local quality by introducing convex and concave features only in specific regions where outer lead bonding is required, while the rest of the substrate maintains its original flat structure. This localized structural modification minimizes the impact on overall substrate simplicity while achieving the border reduction goal
Data Source
AI summary
A touch display apparatus having a fan-out side is provided. The touch display apparatus includes a first substrate, a second substrate, a touch sensing element and a display element. The first and the second substrate have a first surface and a second inner surface, respectively. The second substrate is disposed opposite to the first substrate. The second inner surface faces the first inner surface. The second substrate has a convex part and a concave part on the fan-out side. The second inner surface has a second outer lead bonding region in the convex part. The first outer lead bonding region of the first substrate is unshielded by the second substrate through the concave part. The second outer lead bonding region of the second substrate is unshielded by the first substrate. The touch sensing element and the display element are packaged in between the first and the second substrates.