Touch Display IC Pin Arrangement Reduces Metal Layers
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Solution Overview
Problem
Conventional touch display panels require multiple metal layers for wire layout due to interlacing conductive lines from touch and display drivers, increasing manufacturing costs and reducing production yield.
Innovation Solution
A touch and display sensing integrated circuit with a longitudinal arrangement of touch input/output pins and data output pins on a substrate, allowing for alternate placement of touch sensing and display data pads without interlacing, reducing the need for multiple metal layers by using the same metal layer for fan-out wires.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If outer lead bonding positions of touch driver are arranged on two sides and display driver in the middle of single chip controller, then all pins of single chip controller can be satisfied, but conductive lines of touch driver and display driver interlace requiring multiple metal layers
Solution Approach 1:
The patent inverts the conventional arrangement by placing touch driver bonding positions in the middle and display driver bonding positions on the two sides of the single chip controller, opposite to the traditional configuration. This inversion allows conductive lines to be routed without interlacing, enabling the use of a single metal layer instead of multiple layers.
Solution Approach 2:
The patent changes the spatial arrangement dimension by distributing bonding positions across different locations (middle vs. sides) and utilizing the longitudinal arrangement of pins, transforming the routing problem from a planar constraint to a three-dimensional solution space that avoids line interlacing.
2Reliability
If multiple metal layers are used for wire layout to avoid interlacing, then signal interference is prevented, but manufacturing cost increases and production yield decreases
Solution Approach 1:
The patent extracts the constraint of multiple metal layers by redesigning the bonding position arrangement, allowing the entire wire layout to be completed on a single metal layer while still preventing signal interference through proper spatial separation of conductive lines.
Solution Approach 2:
The patent changes the key parameter of metal layer count from multiple to single, and achieves this by modifying the bonding position configuration parameters, specifically placing touch driver positions in the middle and display driver positions on the sides with longitudinal pin arrangement.
3Adaptability or versatility
If multiple metal layers are used for wire layout, then routing flexibility is improved, but manufacturing complexity and cost increase
Solution Approach 1:
The patent inverts the conventional bonding position arrangement to achieve routing flexibility without requiring multiple metal layers, thereby simplifying the manufacturing process while maintaining the ability to route all necessary signals.
Data Source
AI summary
A touch and display sensing integrated circuit and a touch display device using the same are provided. The touch display device includes a display and touch sensing integrated circuit and a glass substrate. The glass substrate includes touch/display common voltage electrodes, pixels, pads and conductive lines. Each pixel includes Q sub-pixels. The pads are electrically connected to the touch and display sensing integrated circuit. The Pth and (P+Q+1)th pads are electrically connected to the touch/display common voltage electrode through the corresponding conductive lines, respectively. The (P+1)th to (P+Q)th pads are electrically connected to 1st to Qth sub-pixels of a pixel through the corresponding conductive lines, respectively. The pads are arranged in a first direction, and the conductive lines, which are electrically connected to the pads in a second direction, are non-interlaced.